Simulative Design of Pad Structure for High Density Electronic Interconnection

材料科学技术（英文）, 2005, 21(1): 63-67.

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1.State Key Lab. of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China;Shenzhen Graduate School of Harbin Institute of Technology, Shenzhen 518055, China

基金项目: This work was supported by the Chinese Laboratory of Precision Thermal Treatment Foundation under(98JS61.6.1ZS6107)

Simulative Design of Pad Structure for High Density Electronic Interconnection

Keywords： Solder bridge

Solder bridge is a serious defect of solder joints in ultrafine pitch electronic device assemblies. Generation of the solder bridge is closely related to forming process of the solder joints. A three-dimensional model to simulate the formation of the solder bridge of QFP256 (quad flat packaging with 256 leads) is established and numerically calculated to predict the formation shape of the solder joints using surface evolver program. Based on the model, influence of structure of pads printed on circuit board on solder bridging is investigated. The results show that there is a critical solder volume Vc for solder joints to avoid solder bridging, and parameters of the pad size influence the critical solder volume.

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Simulative Design of Pad Structure for High Density Electronic Interconnection

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