从钨铜合金表面化学镀NiP镀层的表面形貌及成分，镀层结构，外观，结合力，硬度，耐磨性，孔隙率，纤焊性等方面进行了检测和表征.结果表明，化学镀NiP合金层磷含量为11.37%，属于高磷镀层，主要为非晶型结构，在钨铜合金表面化学镀Ni-P合金可以大大提高钨铜合金的硬度和耐磨性，且Ni-P合金镀层与钨铜合金基体结合强度好，孔隙率低，纤焊性好.
The surface morphology and composition,microstructure,appearance,adhesion,hardness,antiabration ability,porosity ratio,solder ability and corrosion resistance of electroless Ni-P alloy plating on W-Cu alloy were investigated.The result indicates that the Ni-P alloy coating belongs to high phosphorus coating with P content 11.37 wt.% and it is amorphous in nature,and the anti-abrasion ability and hardness of W-Cu alloy was greatly improved by electroless Ni-P alloy plating.Meanwhile,the Ni-P alloy coating has a qualified adhesion with W-Cu alloy substrate with lower porosity ratio and good solderability and the deposit can offer fairly good protection to W-Cu alloy substrate in 3.5 wt.% NaCl solution,artificial sweat solution and 10% H2SO4 solution.
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