通过赫尔槽试验和方槽试验，研究了不同主盐对 HEDP (羟基亚乙基二膦酸)体系电镀铜沉积速率、电流效率、镀层外观、厚度、结合力等的影响。镀液组成为：HEDP 160 g/L，Cu2+10 g/L，K2CO360 g/L，pH 9.0。结果表明，由于阴离子不同，铜盐种类会影响电镀过程和镀层性能。HEDP 体系镀铜液的最佳主盐为CuSO4·5H2O。以CuSO4·5H2O为主盐时，电流效率为92.5%，镀速为0.18μm/min，所得铜镀层表面平整、致密，与钢铁基体的结合力良好。
The effects of different main salts on the deposition rate and current efficiency of copper plating from HEDP system, and on the appearance, thickness, and adhesion strength of copper coating were studied by testing in Hull cell and square cell. The plating bath (pH 9.0) is composed of HEDP 160 g/L, Cu2+10 g/L, and K2CO3 60 g/L. The results showed that the plating process and coating properties are greatly affected by the type of copper salt used due to the difference in anions. The optimal main salt for HEDP copper plating is CuSO4·5H2O. Using CuSO4·5H2O as the main salt, a smooth and compact copper coating can be deposited with a current efficiency of 92.5%, deposition rate of 0.18μm/min, and strong adhesion to steel substrate.
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