基于Wheeler等提出的纯扩散相场模型,建立耦合溶质场、温度场和流场的相场模型,采用有限差分法对控制方程进行数值求解,研究Ni-Cu合金凝固过程中单晶粒枝晶和多晶粒枝晶在强制对流作用下的生长行为.结果表明:熔体的流动显著改变凝固前沿的传热和传质,从而改变枝晶的生长行为.在流速为6.43 m/s的垂直强制对流作用下,上游枝晶受过冷熔体冲刷,枝晶尖端溶质浓度和温度低,实际过冷度大,枝晶生长迅速,稳态生长速度比纯扩散时增加28%;热量和溶质在下游富集,下游枝晶尖端溶质浓度和温度高,实际过冷度小,枝晶生长缓慢,稳态生长速度比纯扩散时减小26%.
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