综述了镀铜研究中常用的电化学方法,包括恒电位技术、线性电势扫描伏安法、恒电流技术和交流阻抗技术,展望了电化学方法在镀铜研究中运用的前景.
参考文献
[1] | 余德超,谈定生.电镀铜技术在电子材料中的应用[J].电镀与涂饰,2007(02):43-47. |
[2] | 何建平.无氰电镀工艺的研究现状及解决问题的途径[J].电镀与涂饰,2005(07):42-45. |
[3] | 汪龙盛,苏丽琴,王春霞.钢铁基体无氰镀铜结合力的研究进展[J].电镀与精饰,2007(05):25-29. |
[4] | 杨防祖,姚士冰,周绍民.电化学沉积研究[J].厦门大学学报(自然科学版),2001(02):418-426. |
[5] | 辜敏,杨防祖,黄令,姚士冰,周绍民.氯离子对铜在玻碳电极上电结晶的影响[J].化学学报,2002(11):1946-1950. |
[6] | 冯绍彬,商士波,包祥,冯丽婷,张经纬,李宗慧.电位活化现象与金属电沉积初始过程的研究[J].物理化学学报,2005(05):463-467. |
[7] | 蔡加勒;周绍民 .线性扫描伏安法在电镀工业中的分析应用[J].表面技术,1995,24(03):24-28. |
[8] | 许家园.酸性镀铜液中Cl-离子的作用机理研究[J].厦门大学学报,1994(05):647. |
[9] | 贾铮;戴长松;陈玲.电化学测试方法[M].北京:化学工业出版社,2006 |
[10] | 刘烈炜,卢波兰,吴曲勇,杨志强.钢铁化学置换镀铜的研究[J].腐蚀与防护,2004(12):523-525. |
[11] | 查全性.电极过程动力学导论[M].北京:科学出版社,2002 |
[12] | SCHARIFKER B;HILLS G .Theoretical and experimental studies of multiple nucleation[J].Electrochimica Acta,1983,28(07):879-889. |
[13] | V. San Martin;S. Sanllorente;S. Palmero .Optimization of influent factors on nucleation process of copper in solutions containing thiourea using an experimental design[J].Electrochimica Acta,1998(4):579-585. |
[14] | 黄令,张睿,辜敏,杨防祖,许书楷,周绍民.烟酸对酸性硫酸盐体系铜电沉积的影响[J].物理化学学报,2002(07):665-668. |
[15] | Nikolic ND;Popov KI;Pavlovic LJ;Pavlovic MG .Morphologies of copper deposits obtained by the electrodeposition at high overpotentials[J].Surface & Coatings Technology,2006(3/4):560-566. |
[16] | K. Murase;K. Nitta;T. Hirato;Y. Awakura .Electrchemical behaviour of copper in trimethyl-n-hexylammonium bis((trifluoromethyl)sulfonyl)amide, an ammonium imide-type room temperature molten salt[J].Journal of Applied Electrochemistry,2001(10):1089-1094. |
[17] | NICHOLSON R S;SHAIN I .Theory of stationary electrode polarography:single seen and cyclic methods applied to reversible,irreversible,and kinetic systems[J].Analytical Chemistry,1964,36(04):706-723. |
[18] | De Almeida MRH.;Carlos IA.;Barbosa LL.;Carlos RM.;Lima-Neto BS. Pallone EMJA. .Voltammetric and morphological characterization of copper electrodeposition from non-cyanide electrolyte[J].Journal of Applied Electrochemistry,2002(7):763-773. |
[19] | 王玥,郭晓斐,林晓娟,冯立明.柠檬酸铵对丙三醇无氰镀铜工艺的影响[J].表面技术,2006(04):40-41,45. |
[20] | 许家园,周绍民.伏安法快速测定镍、铬、铁和铜镀液中氯离子的浓度[J].分析测试技术与仪器,1994(01):22-27. |
[21] | 黄清安.电镀铜-镍合金时的阴极行为研究[J].材料保护,1993(11):4. |
[22] | 刘烈炜,吴曲勇,卢波兰,杨志强.有机染料对酸性镀铜电沉积的影响[J].材料保护,2004(07):4-6,13. |
[23] | BARD A J;FAULKNER L R;邵元华;朱果逸,董献堆.电化学方法原理和应用[M].北京:化学工业出版社,2005 |
[24] | VARVARA S;MURESAN L;POPESCU I C et al.Copper electrodeposition from sulfate electrolytes in the presence of hydroxyethylated 2-butyric-1,4-diol[J].Hydrometallurgy,2004,75(1-4):147-156. |
[25] | Danilov AI.;Molodkina EB.;Polukarov YM.;Moller P. Ulstrup J.;Andersen JET. .The influence of intermediate particles on the nucleation of copper on polycrystalline platinum[J].Electrochimica Acta,1998(7):733-741. |
[26] | B.-H. WU;C.-C. WAN;Y.-Y. WANG .Calculation of the current density distribution of submicron copper electroplating based on uneven adsorption of poly(ethylene glycol)[J].Journal of Applied Electrochemistry,2005(3):305-310. |
[27] | Carlos IA.;Pallone EMJA.;Francisco RHP.;Cardoso V. Lima-Neto BS.;Souza CAC. .Effect of tartrate on the morphological characteristics of the copper-tin electrodeposits from a noncyanide acid bath[J].Journal of Applied Electrochemistry,2000(8):987-994. |
[28] | B. Bozzini;L. D'Urzo;C. Mele;V. Romanello .Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions[J].Journal of Materials Science. Materials in Electronics,2006(11):915-923. |
[29] | 冯绍彬,商士波,冯丽婷.焦磷酸盐电镀铜初始过程研究[J].电化学,2005(02):228-231. |
[30] | 冯绍彬,商士波,冯丽婷,包祥,张经纬,李宗慧.铜铁界面含氧层对镀层结合强度的影响[J].材料保护,2005(06):4-6. |
[31] | 蔡加勒;谭登兵;周绍民 .计时电位法测定电镀电流效率[J].电镀与环保,1989,9(01):1-4. |
[32] | 邓文.酸性镀铜体系的交流阻抗研究[J].电化学,1998(02):152-158. |
[33] | 郑文芝,于欣伟,陈姚,袁国伟,吴倩,钟洪胜.氰化镀铜及乙二胺无氰碱性铜镀体系的EIS研究[J].广东化工,2007(01):35-37. |
[34] | 项民,夏同驰,张琦.贮氢合金表面置换镀铜工艺及电化学性能研究[J].材料保护,2005(01):30-33. |
[35] | 陈卫祥.贮氢合金电极的循环伏安和交流阻抗研究[J].电源技术,2000(04):200-203. |
[36] | 刘烈炜,吴曲勇,卢波兰,杨志强.酸性镀铜研究进展[J].电镀与精饰,2004(05):13-17. |
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