对射频溅射功率80W条件下Ta缓冲层上生长的硅薄膜进行退火并用Raman散射和X射线衍射技术对样品的微观结构进行检测,系统研究了退火温度和退火时间对硅薄膜结晶性的影响.分析结果表明,在560℃退火2h或680℃退火1h之后,硅薄膜开始晶化,并且随着退火温度的增加或退火时间延长,薄膜逐渐由非晶向微晶转变.获得了可用于太阳能电池的微晶硅薄膜的最佳晶化参数.
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