{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"通过镀金层的表面形貌观察和成分测定,分析了<span style=\"color:red\">陶瓷封装</span>外壳镀金层在350℃空气气氛下高温试验2h后变色的原因.研究了分别以Ni镀层、Ni-Co合金和Ni/Ni-Co复合镀层作底层时<span style=\"color:red\">陶瓷封装</span>外壳的抗高温变色能力.结果表明,<span style=\"color:red\">陶瓷封装</span>外壳变色是由底层镍扩散到镀金层表面形成氧化镍所致.以Ni-Co合金和Ni/Ni-Co复合镀层作底层可有效阻止镍的扩散,从而提高<span style=\"color:red\">陶瓷封装</span>外壳的抗高温变色能力.","authors":[{"authorName":"路聪阁","id":"a2a7ea3d-1a07-436b-a81f-f028d2d12d62","originalAuthorName":"路聪阁"},{"authorName":"刘圣迁","id":"ade27db6-55a4-49c7-bfe7-1ae732dc2f1c","originalAuthorName":"刘圣迁"}],"doi":"","fpage":"730","id":"23bd7ed7-49ed-4352-a2fb-27828d2d8b6c","issue":"13","journal":{"abbrevTitle":"DDYTS","coverImgSrc":"journal/img/cover/DDYTS.jpg","id":"21","issnPpub":"1004-227X","publisherId":"DDYTS","title":"电镀与涂饰   "},"keywords":[{"id":"b0e9e9e1-72f9-4ece-84f4-3b2bda96ac9e","keyword":"<span style=\"color:red\">陶瓷封装</span>","originalKeyword":"陶瓷封装"},{"id":"0a574379-10b3-4b1f-9ecf-f0a928412665","keyword":"变色","originalKeyword":"变色"},{"id":"56d1e24a-cace-48da-9b6f-db28c76e657e","keyword":"高温","originalKeyword":"高温"},{"id":"85621fb2-d4ed-48de-854e-6f84f6c22376","keyword":"金层","originalKeyword":"金层"},{"id":"322f23e1-d38b-4d19-87a1-828f494e9528","keyword":"镍钴合金","originalKeyword":"镍钴合金"}],"language":"zh","publisherId":"ddyts201513005","title":"镍钴合金镀层对<span style=\"color:red\">陶瓷封装</span>外壳抗高温变色能力的影响","volume":"34","year":"2015"},{"abstractinfo":"为了使用Ni-Co合金代替Ni作为<span style=\"color:red\">陶瓷封装</span>电镀金层的底镀层以提高它的抗高温老化能力,系统地研究了从氨基磺酸盐镀液中获得低Co含量Ni-Co合金镀层的规律.研究发现镀层中Co含量随着镀液中Co含量的升高而升高,随着镀液中温度的升高而略有上升,随着电流密度的上升而下降,镀液pH值对镀层中Co含量基本没有什么影响.研究还发现镀层中加入Co能够降低镀层的内应力,但同时引起镀层硬度的上升.推荐在<span style=\"color:red\">陶瓷封装</span>中使用含15%Co(质量分数)左右的Ni-Co合金镀层来代替Ni作为底镀层.","authors":[{"authorName":"王占华","id":"8d16a816-d904-42c6-9c23-7662ddc7a4a6","originalAuthorName":"王占华"},{"authorName":"沈卓身","id":"07fb56c4-03f8-4af4-a79b-bfd6ca1c2a5e","originalAuthorName":"沈卓身"},{"authorName":"郭育雄","id":"730e1e05-b82f-4116-89e1-9214f4ebb467","originalAuthorName":"郭育雄"}],"doi":"10.3969/j.issn.1001-1560.2003.02.011","fpage":"30","id":"9c86e2e0-5b2b-480d-b20f-b660612180ae","issue":"2","journal":{"abbrevTitle":"CLBH","coverImgSrc":"journal/img/cover/CLBH.jpg","id":"7","issnPpub":"1001-1560","publisherId":"CLBH","title":"材料保护"},"keywords":[{"id":"9a937ec9-6ae4-4276-b9fa-b0c2a055e7bd","keyword":"Ni-Co合金","originalKeyword":"Ni-Co合金"},{"id":"27edf42b-1dd6-451f-96e9-63441e40597c","keyword":"电镀","originalKeyword":"电镀"},{"id":"a79bb2f6-7925-4572-b562-638650466531","keyword":"内应力","originalKeyword":"内应力"},{"id":"27af2026-f0ff-478f-bb36-c8be6aa2fd33","keyword":"硬度","originalKeyword":"硬度"},{"id":"19102af5-cbeb-4156-bc43-806621f2f779","keyword":"<span style=\"color:red\">陶瓷封装</span>","originalKeyword":"陶瓷封装"}],"language":"zh","publisherId":"clbh200302011","title":"<span style=\"color:red\">陶瓷封装</span>电沉积Ni-Co合金的研究","volume":"36","year":"2003"},{"abstractinfo":"针对微型<span style=\"color:red\">陶瓷封装</span>体电阻器的特点和用户对零件的特殊性能要求,介绍了其电镀工艺实施过程的注意事项.探讨了各工序溶液体系、镀层厚度、电镀工艺条件、导电介质的形状及大小等因素对电阻器可焊性和耐焊接热性能的影响.最终确定对微型<span style=\"color:red\">陶瓷封装</span>体电阻器先电镀半光亮镍再电镀哑光锡,得到具有优良附着力、焊接性和耐焊接热性能的镀层.","authors":[{"authorName":"任雅勋","id":"2d8a0679-99d7-45cb-9f7c-1511eadca393","originalAuthorName":"任雅勋"},{"authorName":"张春雷","id":"7d747260-5478-4ae2-973c-b0d458fc8618","originalAuthorName":"张春雷"}],"doi":"","fpage":"1060","id":"1fdd7072-c47f-4999-918f-d2ab04a657b2","issue":"24","journal":{"abbrevTitle":"DDYTS","coverImgSrc":"journal/img/cover/DDYTS.jpg","id":"21","issnPpub":"1004-227X","publisherId":"DDYTS","title":"电镀与涂饰   "},"keywords":[{"id":"f39e5473-a6ff-41c5-9076-4ecbbf7bb75a","keyword":"微型<span style=\"color:red\">陶瓷封装</span>体电阻器","originalKeyword":"微型陶瓷封装体电阻器"},{"id":"b730ede3-b808-442f-b686-a861e08d07e9","keyword":"电镀","originalKeyword":"电镀"},{"id":"e7386754-f9c9-4340-a1d1-f32ed85f759d","keyword":"镍","originalKeyword":"镍"},{"id":"34d1008d-be0f-406f-8702-95ef810a6d46","keyword":"锡","originalKeyword":"锡"},{"id":"16ad7586-a74b-4292-95dc-94ae846fdaf3","keyword":"附着力","originalKeyword":"附着力"},{"id":"323671f1-b1d0-4e28-bf5f-bc3d623024ef","keyword":"可焊性","originalKeyword":"可焊性"},{"id":"00eccd47-febb-48ec-8beb-25ea3d7b09db","keyword":"耐焊接热性能","originalKeyword":"耐焊接热性能"}],"language":"zh","publisherId":"ddyts201424006","title":"微型<span style=\"color:red\">陶瓷封装</span>体电阻器电镀工艺","volume":"33","year":"2014"},{"abstractinfo":"本文用等温凝固技术研究了Au-In合金在<span style=\"color:red\">陶瓷封装</span>装片中的应用.结果表明,通过一种多层结构设计和机械振动的作用,硅芯片可在250oC～300oC、2.1N/mm2的静态加载压力和流量为0.5l/min的氮气环境下焊接到氧化铝衬底上,绝大多数样品的剪切强度符合MILSTD883D美国军方标准,焊层具有良好的可靠性,在-55oC～+125oC之间1750周热循环试验后,剪切强度仅有微量下降.同时,用金相方法对热循环试验前后的焊层微结构进行了分析.","authors":[{"authorName":"施建中","id":"3317d4e5-28fd-4d78-8aac-e4bd7c27d83b","originalAuthorName":"施建中"},{"authorName":"王铁兵","id":"63022b88-b5dc-4c55-a526-32a554cf9731","originalAuthorName":"王铁兵"},{"authorName":"谢晓明","id":"9c214dbd-f488-4b18-97ff-8d569ca8cfe2","originalAuthorName":"谢晓明"}],"doi":"10.3969/j.issn.1007-4252.2000.02.010","fpage":"119","id":"180787ec-c7c7-4d0f-9da2-ba9132a553a1","issue":"2","journal":{"abbrevTitle":"GNCLYQJXB","coverImgSrc":"journal/img/cover/GNCLYQJXB.jpg","id":"34","issnPpub":"1007-4252","publisherId":"GNCLYQJXB","title":"功能材料与器件学报   "},"keywords":[{"id":"533df8e7-586f-43fb-b5bf-c718b4870f6a","keyword":"装片","originalKeyword":"装片"},{"id":"b5fc8b5f-7919-46e3-a9cb-7c1a59c8179b","keyword":"等温凝固","originalKeyword":"等温凝固"},{"id":"b2bae4ac-f620-4ca8-b3b1-2be6201ecd53","keyword":"剪切强度","originalKeyword":"剪切强度"},{"id":"a4869ae0-d49e-49e2-a5c8-4e174eaa3257","keyword":"热循环","originalKeyword":"热循环"},{"id":"abc098bc-a33e-4906-aa55-0b94f76b5b1e","keyword":"微结构","originalKeyword":"微结构"}],"language":"zh","publisherId":"gnclyqjxb200002010","title":"Au/In合金在<span style=\"color:red\">陶瓷封装</span>装片中的应用","volume":"6","year":"2000"},{"abstractinfo":"研究了在<span style=\"color:red\">陶瓷</span>PGA 370和RP 54等具有分离(导体)结构的金属导体和引脚的高密度<span style=\"color:red\">封装</span>的局部镀金技术.结果表明:采用分步化学镀和电镀相结合的方法,适当控制化学镀和电镀工艺条件,可以成功地实现上述<span style=\"color:red\">封装</span>的局部镀金.","authors":[{"authorName":"刘巧明","id":"4cfbcdb7-2a86-42af-9178-c3cf4146f6cb","originalAuthorName":"刘巧明"},{"authorName":"夏传义","id":"4271410f-6667-4b1c-b3d4-cfa1e42b566f","originalAuthorName":"夏传义"},{"authorName":"张志谦","id":"383f1722-26c0-4bac-a1ec-8f11842b6e91","originalAuthorName":"张志谦"}],"doi":"10.3969/j.issn.1004-227X.2001.04.007","fpage":"23","id":"66e6aabd-4bab-41ad-96c9-9481ad2b1b2b","issue":"4","journal":{"abbrevTitle":"DDYTS","coverImgSrc":"journal/img/cover/DDYTS.jpg","id":"21","issnPpub":"1004-227X","publisherId":"DDYTS","title":"电镀与涂饰   "},"keywords":[{"id":"b6b23df8-1c82-4d75-aa0d-dbe4c3032f5b","keyword":"高密度<span style=\"color:red\">封装</span>","originalKeyword":"高密度封装"},{"id":"5e252fb6-664e-4d14-a76c-1ee32d6bafdb","keyword":"化学镀镍","originalKeyword":"化学镀镍"},{"id":"93001452-c7b1-440d-a3d3-b164a8849487","keyword":"局部镀金","originalKeyword":"局部镀金"}],"language":"zh","publisherId":"ddyts200104007","title":"PGA370高密度<span style=\"color:red\">陶瓷封装</span>局部镀金","volume":"20","year":"2001"},{"abstractinfo":"简要论述了金属<span style=\"color:red\">封装</span>材料、<span style=\"color:red\">陶瓷封装</span>材料、塑料<span style=\"color:red\">封装</span>材料的性能特点,以及各自作为<span style=\"color:red\">封装</span>材料存在的性能缺陷,并着重阐述了金属基复合材料作为电子<span style=\"color:red\">封装</span>材料的性能优势及其在电子<span style=\"color:red\">封装</span>技术中的发展现状,展望了金属基复合材料的发展趋势及应用前景.","authors":[{"authorName":"朱敏","id":"f2c326ac-cc9f-4f38-96bb-089fbfe2e76e","originalAuthorName":"朱敏"},{"authorName":"孙忠新","id":"bdc2e59c-0b94-41b8-b88a-5457ef3256ea","originalAuthorName":"孙忠新"},{"authorName":"高锋","id":"49cf3650-be7b-4025-ae82-80332e6bc1d2","originalAuthorName":"高锋"},{"authorName":"刘晓阳","id":"dcdf2f77-0307-42f2-9c38-e99026d3dff8","originalAuthorName":"刘晓阳"}],"doi":"","fpage":"181","id":"1b07ae2e-b89e-43ae-948a-52eacf075f85","issue":"z2","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"ed876893-17e8-4458-b2ac-4c93a2bcaffa","keyword":"电子<span style=\"color:red\">封装</span>材料","originalKeyword":"电子封装材料"},{"id":"4f2c42cf-459a-4524-b9ea-7a8cb1877316","keyword":"传统<span style=\"color:red\">封装</span>材料","originalKeyword":"传统封装材料"},{"id":"ff245fd3-89b1-46ce-844b-c2df6539ce68","keyword":"金属基复合材料","originalKeyword":"金属基复合材料"}],"language":"zh","publisherId":"cldb2013z2049","title":"电子<span style=\"color:red\">封装</span>用金属基复合材料的研究现状","volume":"27","year":"2013"},{"abstractinfo":"简要介绍了电子<span style=\"color:red\">封装</span>发展情况及其对基片材料的性能要求,分析了<span style=\"color:red\">陶瓷</span>基片作为<span style=\"color:red\">封装</span>材料性能上的优点,概述了几种常用<span style=\"color:red\">陶瓷</span>基片材料的优缺点及其应用:Al2O3作为传统的<span style=\"color:red\">陶瓷</span>基片材料,优点是成熟的工艺和低廉的价格,但热导率不高;BeO、BN、SiC等都具有高热导率,在某些<span style=\"color:red\">封装</span>场合是合适的选择;AIN综合性能最好,是最有希望的电子<span style=\"color:red\">封装</span><span style=\"color:red\">陶瓷</span>基片材料.介绍了多层<span style=\"color:red\">陶瓷</span>基片材料的共烧技术和流延成型技术,并指出LTCC技术和水基流延将是未来发展的重点.","authors":[{"authorName":"张兆生","id":"de246bc6-d54e-49e1-a2bd-f7a36175a9c0","originalAuthorName":"张兆生"},{"authorName":"卢振亚","id":"7ae68639-e2d5-4802-98f6-c2c1150f5451","originalAuthorName":"卢振亚"},{"authorName":"陈志武","id":"5651beb6-f712-4b04-848b-03b40cb34ded","originalAuthorName":"陈志武"}],"doi":"","fpage":"16","id":"ab01cc19-27fd-4d01-b236-37373f903233","issue":"11","journal":{"abbrevTitle":"CLDB","coverImgSrc":"journal/img/cover/CLDB.jpg","id":"8","issnPpub":"1005-023X","publisherId":"CLDB","title":"材料导报"},"keywords":[{"id":"432c1dfe-7ff9-4b6d-a31d-c59b90015621","keyword":"电子<span style=\"color:red\">封装</span>","originalKeyword":"电子封装"},{"id":"0b5f8696-10bd-43fa-be9a-f0cec0931d64","keyword":"<span style=\"color:red\">陶瓷</span>基片","originalKeyword":"陶瓷基片"},{"id":"b2cb40ed-ab33-4d0d-8225-356703959532","keyword":"共烧","originalKeyword":"共烧"},{"id":"1e450bad-547c-4d4b-b8b1-ab69cb476da6","keyword":"流延","originalKeyword":"流延"}],"language":"zh","publisherId":"cldb200811004","title":"电子<span style=\"color:red\">封装</span>用<span style=\"color:red\">陶瓷</span>基片材料的研究进展","volume":"22","year":"2008"},{"abstractinfo":"总结微电子<span style=\"color:red\">封装</span>技术对<span style=\"color:red\">封装</span>基片材料性能的要求,论述Al2O3、AlN、BeO、SiC和Si3N4<span style=\"color:red\">陶瓷</span>基片材料的特点及其研究现状,其中AlN<span style=\"color:red\">陶瓷</span>基片的综合性能最好.分析轧膜、流延和凝胶注模薄片<span style=\"color:red\">陶瓷</span>成型工艺的优缺点,其中水基凝胶注模成型工艺适用性较强;指出<span style=\"color:red\">陶瓷</span>基片材料和薄片<span style=\"color:red\">陶瓷</span>成型工艺的发展趋势.","authors":[{"authorName":"李婷婷","id":"66439aa3-1a76-49c9-ac87-54f35665f6b3","originalAuthorName":"李婷婷"},{"authorName":"彭超群","id":"401b2c18-aeb8-4828-9e82-c9293eba2480","originalAuthorName":"彭超群"},{"authorName":"王日初","id":"7809495e-e609-4918-bd8a-302e3a94a08a","originalAuthorName":"王日初"},{"authorName":"王小锋","id":"1c4ee9cf-d663-4423-8f5f-afe117bd617a","originalAuthorName":"王小锋"},{"authorName":"刘兵","id":"1d03c340-4ac9-4a99-9ab0-bb11502b53c1","originalAuthorName":"刘兵"}],"doi":"","fpage":"1365","id":"c0209f24-4675-46a6-8285-6b723fbacbac","issue":"7","journal":{"abbrevTitle":"ZGYSJSXB","coverImgSrc":"journal/img/cover/ZGYSJSXB.jpg","id":"88","issnPpub":"1004-0609","publisherId":"ZGYSJSXB","title":"中国有色金属学报"},"keywords":[{"id":"d55f8bbf-891c-4156-a98a-3f7aac3ccd0b","keyword":"电子<span style=\"color:red\">封装</span>材料","originalKeyword":"电子封装材料"},{"id":"89541316-d178-4d7c-ad7a-ebf08ec968f7","keyword":"Al2O3<span style=\"color:red\">陶瓷</span>","originalKeyword":"Al2O3陶瓷"},{"id":"4b9fea9e-d3ef-4792-987c-0a0ecfdaf776","keyword":"AlN<span style=\"color:red\">陶瓷</span>","originalKeyword":"AlN陶瓷"},{"id":"86305e43-e62b-427c-ac6b-dafbd3a15015","keyword":"BeO<span style=\"color:red\">陶瓷</span>","originalKeyword":"BeO陶瓷"},{"id":"bd38fcf0-8d26-4ad5-aeef-881dab800dd1","keyword":"SiC<span style=\"color:red\">陶瓷</span>","originalKeyword":"SiC陶瓷"},{"id":"70c3c6a2-e968-402e-9474-0389ed4f8016","keyword":"Si3N4<span style=\"color:red\">陶瓷</span>","originalKeyword":"Si3N4陶瓷"},{"id":"cb54f9a0-7f0e-4b35-b51c-abe2174cff5b","keyword":"流延成型","originalKeyword":"流延成型"},{"id":"0eb308fb-1ec1-4554-8e75-0265be564d65","keyword":"凝胶注模成型","originalKeyword":"凝胶注模成型"}],"language":"zh","publisherId":"zgysjsxb201007019","title":"电子<span style=\"color:red\">封装</span><span style=\"color:red\">陶瓷</span>基片材料的研究进展","volume":"20","year":"2010"},{"abstractinfo":"传统的<span style=\"color:red\">陶瓷</span>-金属复合装甲为简单的双层结构,其中<span style=\"color:red\">陶瓷</span>作为迎弹面板.金属作为能量吸收背板.这种结构的明显不足是其抗多发弹能力差.用金属将<span style=\"color:red\">陶瓷</span>包裹起来是提高装甲抗多发弹能力的一个有效方法.<span style=\"color:red\">封装</span>金属为<span style=\"color:red\">陶瓷</span>提供了最大程度的结构限制,因而有助于提高复合装甲抗多发弹的能力.主要介绍目前制备金属<span style=\"color:red\">封装</span><span style=\"color:red\">陶瓷</span>复合装甲的方法,探讨其中的关键技术.","authors":[{"authorName":"韩辉","id":"8d269fcf-e5e0-430f-8348-9c91a199a10b","originalAuthorName":"韩辉"},{"authorName":"李楠","id":"768a8e2f-157c-479a-ad8b-3a6893736da1","originalAuthorName":"李楠"}],"doi":"10.3969/j.issn.1004-244X.2008.04.020","fpage":"79","id":"6c490dec-cb54-4600-95b9-fdd8dcdc3d7c","issue":"4","journal":{"abbrevTitle":"BQCLKXYGC","coverImgSrc":"journal/img/cover/BQCLKXYGC.jpg","id":"4","issnPpub":"1004-244X","publisherId":"BQCLKXYGC","title":"兵器材料科学与工程   "},"keywords":[{"id":"d4ee60fb-26b6-4e2d-ac28-33cb435eae79","keyword":"防弹","originalKeyword":"防弹"},{"id":"23e085a4-aef8-465a-b36d-b820dd2e4e36","keyword":"<span style=\"color:red\">陶瓷</span>-金属复合装甲","originalKeyword":"陶瓷-金属复合装甲"},{"id":"ea746913-1a71-4aa5-abdd-bb0517355499","keyword":"综述","originalKeyword":"综述"},{"id":"a2fed271-ce4c-4bfe-94a6-3d59d5e7d2d2","keyword":"<span style=\"color:red\">封装</span>","originalKeyword":"封装"}],"language":"zh","publisherId":"bqclkxygc200804020","title":"金属<span style=\"color:red\">封装</span><span style=\"color:red\">陶瓷</span>复合装甲研究进展","volume":"31","year":"2008"},{"abstractinfo":"利用真空烧结技术制备了一种可用于白光LED<span style=\"color:red\">封装</span>的Ce:YAG<span style=\"color:red\">陶瓷</span>荧光体.用X射线衍射仪、光致发光激发谱、光致发光谱等测试手段对这种<span style=\"color:red\">陶瓷</span>荧光体进行表征.结果表明:<span style=\"color:red\">陶瓷</span>荧光体的主相为Y3Al5O12,该荧光体可以很好的被470 nm蓝光激发,发射出550 nm的黄光.该<span style=\"color:red\">陶瓷</span>荧光体<span style=\"color:red\">封装</span>蓝光芯片所得的白光LED器件在110℃的高温下老化600小时,光衰只有10%,色坐标无变化,证明其寿命及稳定性远远好于采用传统方式<span style=\"color:red\">封装</span>的白光LED.研究结果表明,该Ce:YAG<span style=\"color:red\">陶瓷</span>荧光体是一种非常适合大功率白光LED<span style=\"color:red\">封装</span>的荧光材料.","authors":[{"authorName":"朱学绘","id":"8915f00d-1b7c-47ab-9da3-9545beb3b196","originalAuthorName":"朱学绘"},{"authorName":"范广涵","id":"09eb8fda-bede-4636-943b-1dd7c26f9834","originalAuthorName":"范广涵"},{"authorName":"王海丽","id":"d8fb6e34-b8a8-4c1c-9e29-573deabb27c2","originalAuthorName":"王海丽"},{"authorName":"沈德忠","id":"26001987-d060-4551-922d-d54ff0721f58","originalAuthorName":"沈德忠"},{"authorName":"章勇","id":"1d477b16-69d2-4ce8-a4be-df70f20a0920","originalAuthorName":"章勇"}],"doi":"10.3969/j.issn.1007-4252.2010.04.017","fpage":"389","id":"cff744c6-fe52-4075-ac65-fa9dff300b50","issue":"4","journal":{"abbrevTitle":"GNCLYQJXB","coverImgSrc":"journal/img/cover/GNCLYQJXB.jpg","id":"34","issnPpub":"1007-4252","publisherId":"GNCLYQJXB","title":"功能材料与器件学报   "},"keywords":[{"id":"b9f671f9-53dd-44f2-855a-0868f6658277","keyword":"LED","originalKeyword":"LED"},{"id":"c00a3de0-0701-41ce-b459-a44948c9e7a7","keyword":"<span style=\"color:red\">陶瓷</span>荧光体","originalKeyword":"陶瓷荧光体"},{"id":"3e1dba47-3a0e-4fbb-aa70-cc6f796ab2a7","keyword":"<span style=\"color:red\">封装</span>","originalKeyword":"封装"},{"id":"12056e78-0aeb-486e-94e5-4d3eac5c254f","keyword":"老化","originalKeyword":"老化"}],"language":"zh","publisherId":"gnclyqjxb201004017","title":"新型Ce:YAG<span style=\"color:red\">陶瓷</span>荧光体<span style=\"color:red\">封装</span>白光LED的性能","volume":"16","year":"2010"}],"totalpage":1064,"totalrecord":10631}