综述了近年来与微型机电系统（MEMS）相关的材料微制造和微加工技术的最新研究进展.重点介绍了如何利用硅晶片作为微型模具来制备压电陶瓷和热电材料的微型柱状阵列结构和反应烧结碳化硅微型转子等微制造技术,并展望了材料微制造技术在研制微型医疗器件和微型移动能源方面的应用前景.
Recent status of microfabrication technology related to microelectromechanical systems (MEMS) is reviewed with
particular emphasis on the introduction of our newly developed three-dimensional microfabrication process using a micromachined silicon wafer
as a mold. By using the silicon molding processes, piezoelectric microrod arrays, thermoelectric microelement arrays and silicon carbide micro gas
turbine rotors have been successfully fabricated. Their microfabrication processes are described in detail to demonstrate the success of the
combination of silicon micromachining and materials processing techniques. The prospects for materials microfabrication in the fields of miniature
medical apparatus and portable microscale energy sources are given.
参考文献
| [1] | |
| [2] | Madou M. Fundamentals of Microfabrication, CRC Press, 1997. 1--52. [2] Esashi M. Japan Vacuum Industry Association Journal, 2000, 72: 18--21. [3] Wakabayashi S I, Nakazawa K, Kaneko N. Materia Japan, 2000, 39 (12): 1003--1009. [4] Becker E W, Ehrfeld W, Hagmann P, et al., Microelectron. Eng., 1986, 4: 35--56. [5] Wang S, Li J-F, Watanabe R, et al. J. Am. Ceram. Soc., 1999, 82 (1): 213--215. [6] Li J-F, Watanabe R, Tanaka S, et al. Materials Integration, 2001, 14 (8): 45--50. [7] Masuda H. OYO BUTURI, 2000, 69 (5): 558--562. [8] Piotter V, Benzler T, Woellmer T, et al. Proceedings of Spie, 1999, 36 (8): 456--463 [9] Kirihara S, Miyamoto Y. Materials Integration, 2001, 14 (8): 21--26. [10] Zhang X, Jiang X N, Sun C. Sensors and Actuators A, 1999, 77: 149--156. [11] Kawata S, Sun H-B, Tanaka T, et al. Nature, 2001, 412: 697--698. [12] Mott M, Song J H, Evans J R G. J. Am. Ceram. Soc., 1999, 82 (7): 1653--1658. [13] 郭瑞松, 齐海涛, 郭多力, 等(GUO Rui-Song, et al). 无机材料学报(Journal of Inorganic Materials), 2001, 16 (6): 1049--1054. [14] Maekawa K. Science of Machine, 1999, 51 (9): 935--941. [15] Masuda Y, Tachibana K, Itoh M, et al. Materials Integration, 2001, 14 (8): 37--44. [16] Xia Y, Gates B, Yin Y, et al. Advanced Materials, 2000, 12 (10): 693--713. [17] Wang S N, Li J-F, Toda R, et al. Proc. IEEE MEMS, 1998. 223--227. [18] Wang S, Li J-F, Wakabayashi K, et al. Advanced Materials, 1999, 11: 873--876. [19] Sugimoto S, Tanaka S, Li J-F, et al. Proceedings of MEMS 2000, IEEE, 2000. 775--779. [20] Tanaka S, Sugimoto S, Li J-F, et al. J. Microelectromechanical Systems, 2001, 10 (1): 55--61. [21] Li J-F, Sugimoto S, Tanaka S, et al. J. Am. Ceram. Soc., 2002, 85 (1), 261--263. [22] Li J-F, Watanabe R, Sugimoto S, et al. Mechanics and Material Engineering for Science and Experiments (ed. by Zhou, Y. Gu Y., Li Z.), Science Press, 2001. 205--209. [23] Li J-F, Watanabe R, Suzuki H, et al. Proc. of Fourth Pacific Rim International Conference on Advanced Materials and Processing (PRICM4, Dec. 11-15, 2001, Honolulu, Hawaii), 2209--2212. [24] Spearing S M. Acta Mater., 2000, 48: 179--196. [25] Janas V F,Safari A. J. Am. Ceram. Soc., 1995, 78 (11): 2945--2955. [26] Hirata Y, Okuyama H, Ogino S, et al. Proc. IEEE Micro Electromechanical Systems (MEMS’95), 191--195. [27] Mehregany M, Zorman C A, Rajan N, et al. Proceedings of the IEEE, 1998, 86 (8): 1594--1610. [28] Yasseen A A, Wu C H, Zorman C A, et al. IEEE Devices Letters, 2000, 21 (4): 164--166. [29] Jacobson S A. AIAA-98-2545 in Proceedings of 29th AIAA Fluid Dynamics Conference (June 15-18, 1998, Albuquerque, NM, USA),1-11. [30] Dornheim M A. Aviation Week & |
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