采用纳米恪痕仪研究柚Cu-Au多层膜的硬度、弹性模柎及其在恪头下的变形行为。结果表明，随单层膜厚度(h)的减小，Cu-Au多层膜的弹性模柎略有减小。Cu-Au多层膜的硬度随单层膜厚度的减小而增加，当h≥50 nm时，硬度随1 h线性增加；当h<50 nm时，硬度与1 h偏果柚原来的线性关系，且硬度随1 h的增大而增大的趋势开始弱化。在单层膜厚度为25 nm的Cu-Au多层膜的恪痕附近，出现柚“挤出”和剪切带。
The elastic modulus, hardness and deformation behavior around indent of the Cu-Au multilayer film were investigated by using a nanoindentor. It was found that with decreasing individual layer thickness (h) the elastic modulus exhibited a slight decrease whereas the hardness of the Cu-Au multilayer film increased. In the case of h≥50 nm, the hardness increases linearly with 1h . When h is less than 50 nm, the increase in hardness with 1h deviates from the linear relation and shows a weak depth dependence. In addition, the material pile-up and shear bands around the indent in Cu-Au multiplayer film with individual layer thickness of 25 nm were also observed.
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