欢迎登录材料期刊网

材料期刊网

高级检索

关于硫酸盐体系中镀铜的沉积机理少见报道,采用循环伏安法和计时电流法研究了铟在硫酸盐体系中电沉积的循环伏安特性与电结晶机理.通过分析恒电位暂态曲线,求出铟离子的扩散系数D和不同电压下的晶核密度N_0.结果表明:铟的电沉积没有经历欠电位沉积过程,而是经历了晶核形成过程,其电沉积反应是一个不可逆过程;在外加电位范围内铜的电结晶按照瞬时成核方式和三维生长方式进行.

The cyclic voltammetry property and electrocrystallization mechanism of indium on vitreous carbon electrode in a sulfate bath were investigated by means of cyclic voltammetry and potential step timing.The diffusion coefficient D of In ions and saturated nuclear number density N_0 were estimated by analyzing the potentiostatic transient curves.Results show that nickel don' t undergo UPD process but nucleation process on the substrate.The electrodeposition reaction was irreversible,and the electrocrystallization of In followed the three-dimensional instantaneous nucleation mechanism.

参考文献

[1] M. Yano;S. Fujitani;K. Nishio;Y. Akai;M. Kurimura .Storage characteristics of mercury-free alkaline manganese batteries[J].Journal of Applied Electrochemistry,1998(11):1221-1225.
[2] 费锡明,彭历,黄正喜,龙光斗,陈琼.无汞碱锰电池锌负极的研究(Ⅱ)[J].华中师范大学学报(自然科学版),2001(01):57-60.
[3] Winkler M;Griesche J;Tober O .CISCuT absorber layersthe present model of thin film growth[J].Thin Solid Films,2001,387:86-88.
[4] Onuma Y;Takeuchi K;Ichikawa S .Preparation and properties of CulnS_2 thin film prepared from electroplated precursor[J].Journal of Solar Energy Engineering,2006,80:132-138.
[5] Valderrama R C;Miranda-Hern M .Electrodeposition of indium onto Mo/Cu for the deposition of Cu(In,ca)Se_2 thin films[J].Electrochimica Acta,2008,53:3714-3721.
[6] 曾华梁;吴仲达;秦月文.电镀工艺手册[M].北京:机械工业出版社,1992:278.
[7] Elwell D;Feigelson R S;Simkins M M .Electrodeposition of indium phosphide[J].Journal of Crystal Growth,1981,51(02):171-177.
[8] 周绍民.金属电沉积--原理与研究方法[M].上海:上海科学技术出版社,1982
[9] 藤屿昭;相泽益男;井上撤;陈震 姚建年.电化学测定方法[M].北京:北京大学出版社,1995
[10] Schariflker B;Hills G .Theoretical and experimental studiesof multiple nucleation[J].Elect rochimica Acta,1983,28(07):879-880.
[11] 徐明丽,张正富,杨显万,李月丽,赵逸群.钯铁合金共沉积行为及其成核机理的研究[J].材料导报,2006(09):158-160.
[12] 郑利峰,郑国渠,曹华珍,张九渊.氨络合物体系中镍在玻璃碳上的电化学成核机理[J].材料科学与工程学报,2003(06):882-885.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%