小尺度材料广泛应用于微电子机械系统及大规模集成电路等微/纳米系统中. 由于这些材料的几何尺度和微观结构尺度均在微米至纳米范围, 它们对位错行为的约束作用以及表面和界面的影响导致了其疲劳行为与块体材料不同. 本文就近年来国内外开展的有关小尺度材料(如薄膜材料)疲劳实验方法、循环形变行、疲劳裂纹的萌生以及扩展行为进行了综述, 对相关的疲劳尺寸效应及机理进行了探讨, 并对今后这一领域的研究前景及方向进行了展望.
Small dimensional materials are widely used in micro/nano--systems, such as large scale integrated circuits and microelectromechanical systems (MEMS). Since the geometric and microstructural dimensions of the materials are ranged from microns to nanometers, the constraints of the dimensions on dislocation activities and the effects of surfaces and interfaces in the small dimensional materials result in fatigue behaviors different from that of the bulk materials. In this paper, fatigue testing methods, cyclic deformation, crack initiation and propagation behaviors of the small dimensional materials studied in recent years, such as thin films, are reviewed. The corresponding fatigue size effects and damage mechanisms are discussed. The prospective research directions of fatigue of small dimensional materials in the future are forecasted.
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| [1] | |
| [2] | |
| [3] | |
| [4] | |
| [5] | |
| [6] | |
| [7] | |
| [8] | |
| [9] | |
| [10] | |
| [11] | |
| [12] | |
| [13] | |
| [14] | |
| [15] | |
| [16] | |
| [17] |
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