首先给出表征XPP、DCPP和S-MDCPP 3种粘弹性本构模型流变特性的物料函数,比较了它们对稳态简单剪切和稳态单轴拉伸流动中熔体复杂流变行为的预测能力.结果表明,SMDCPP本构模型能够较好地反映实际支化高分子熔体的复杂流变行为.最后,讨论了S-MDCPP本构模型中各参数(主链末端支链数q、取向和拉伸松弛时间之比r以及滑移系数ξ)对熔体流变行为的影响.分析表明,主链末端支链数q以及取向和拉伸松弛时间之比r均对熔体的拉伸黏度影响较大,随着q的增加或r的减小,熔体黏度均呈现增加的趋势;随着滑移系数ξ的增加,熔体的剪切黏度降低.
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