采用含氧聚硅氧烷(HPSO)和含乙烯基聚硅氧烷(VPSO)2种陶瓷先驱体作为连接剂的主要组分,以Al-Si粉为填料,通过反应成形连接工艺连接无压烧结碳化硅.采用热重法、差示扫描量热法和X射线衍射法研究了A1-Si粉对HPSO和VPSO的混合物(HPSO-VPSO)的裂解过程和陶瓷产率的影响,同时也研究了Al-Si粉含量、升温速率及连接温度对连接强度的影响.并采用扫描电镜和能谱仪对连接件界面区域的微观结构和成分进行了分析.Al-Si粉的加入促进了 HPSO-VPSO的裂解,提高了陶瓷产率.当HPSO-VPSO与Al-Si粉质量比为1:1,连接压力为50 kPa,连接温度为900℃,高温保温时间为30 min,升温速率为4℃/min时,所得连接件的连接强度(剪切强度)达到最大值93 MPa.连接层厚度约为75μm,结构均匀致密.连接层与母材结合良好,在界面处没有明显的裂纹、孔洞等缺陷.Al、Si元素在连接层与无压烧结碳化硅的界面处发生了扩散,促进了界面结合,从而提高了连接强度.
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