银的电结晶过程直接影响银镀层的性能,但目前很少关注聚乙烯亚胺(PEI)对银电沉积过程的影响.采用循环伏安、计时电流及交流阻抗技术研究了硫代硫酸盐体系中添加PEI前后银电沉积的电化学行为,结合扫描电镜分析了银的电结晶方式.结果表明:PEI对银在硫代硫酸盐体系中的电沉积有阻化作用,添加0.08 g/LPEI可使反应电阻由176.3 Ω·cm2增至427.1 Ω·cm2;加入PEI不改变银的电结晶形核机理,银仍按三维连续成核方式生长,PEI能提高银电结晶成核速度,但会抑制晶体向外生长.
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