平板型SOFC合金连接板的研究进展

功能材料, 2005, 36(12): 1817-1823.

平板型SOFC合金连接板的研究进展

郑群 ^1, , 陈云贵 ^2, , 吴朝玲 ^3, , 王绍荣 ^4, , 陶明大 ^5, , 刘仁柱 ^6, , 庞晓轩 ^7, , 涂铭旌 ^8,

1.四川大学,材料学院,四川,成都,610065

2.四川大学,材料学院,四川,成都,610065

3.四川大学,材料学院,四川,成都,610065

4.中国科学院,上海硅酸盐研究所,上海,200050

5.四川大学,材料学院,四川,成都,610065

6.四川大学,材料学院,四川,成都,610065

7.四川大学,材料学院,四川,成都,610065

8.四川大学,材料学院,四川,成都,610065

基金项目: 国家科技攻关项目(2003AA517012)

关键词： SOFC , 连接板 , 氧化速率 , 面电阻率 , 表面处理

Development of metallic interconnect materials for SOFCs

从材料设计和表面处理方面综述了合金材料作为连接板的研究近况.合金连接板具有高的电子传导和热传导性,成本低,加工性能优良,合金材料表面氧化膜生长速率适中.经过表面处理的合金,在工作过程中涂层与基体发生反应生成更抗氧化的保护层,面电阻率进一步降低,具有很好的应用前景.

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平板型SOFC合金连接板的研究进展

Development of metallic interconnect materials for SOFCs

参考文献