以黄铜为基材,研究了吡啶添加剂-氨盐体系的电镀钯工艺,分析了钯盐、氯化铵、吡啶添加剂质量浓度,温度及pH对镀液和镀层质量的影响.在Pd(NH3)2Cl220 g/L,NH4Cl 15 g/L,NH3·H2O 35 mL/L,吡啶添加剂25 g/L,pH 7～8,温度25～35℃和电流密度0.4～0.5 A/dm2的条件下,获得了厚度达35 μm的光亮钯镀层.该镀层与基体结合力良好,能满足光电经纬仪的工作要求.
A Pd plating process based on the bath containing pyridine additive and ammonium salt was studied with brass as substrate. The effects of mass fractions of Pd salt, NH4Cl and pyridine additive as well as temperature and pH on the bath and deposit quality were analyzed. Bright and 35 μm-thick Pd coatings can be obtained under the following conditions: Pd(NH3)2Cl2 20 g/L, NH4Cl 15 g/L, NH3·H2O 35 mL/L, pyridine additive 25 g/L, pH 7-8, temperature 25-35 ℃, and current density 0.4-0.5 A/dm2. The results showed that the Pd coating has good adhesion and is suitable for optoelectronic theodolite.
参考文献
| [1] | ABYS J A .Palladium plating[J].Plating and Surface Finishing,1995,82(08):67-68. |
| [2] | ABYS J A;STRASCHIL H K;KADIJA I et al.The electrodeposition and material properties of palladium-nickel alloys[J].Metal Finishing,1991,89(07):43-52. |
| [3] | 王丽丽.电镀Pd-As合金[J].材料保护,1994(05):24. |
| [4] | 徐明丽,张正富,杨显万,杨勇彪,马全宝.钯及其合金电镀的研究现状[J].材料保护,2003(10):4-8. |
| [5] | 杨防祖,黄令,姚士冰,许书楷,周绍民.钯及其合金的电沉积[J].电镀与精饰,2002(02):20-27. |
| [6] | 张允诚;胡如南;向荣.电镀手册[M].北京:国防工业出版社,1998:440-441. |
| [7] | 方景礼.多元络合物电镀[M].北京:国防工业出版社,1983:203. |
| [8] | LEWIS F A.The palladium-hydrogen system[M].London,UK:Academic Press,1967:178. |
| [9] | 杨防祖.纯钯电沉积及其成核机理研究[J].电化学,1997(01):103. |
| [10] | ROSAMILIA J M;ABYS J A;MILLER B .Electrochemical hydrogen insertion into palladium and palladium-nickel thin films[J].Electrochimica Acta,1991,36(07):1203-1208. |
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