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采用低碳钢作为外包套材料,通过原位法粉末装管工艺(in-situ PIT)制备出高密度Ti、Zr掺杂的MgB2/Fe/Cu线材.将线材短样在氩气保护条件下,于650~800 ℃烧结2-5 h.MgB2线材的微结构分析显示,通过该工艺制备的MgB2/Fe/Cu线材比MgB2块材具有更好的晶粒连结性和更高的致密度.采用标准的四引线法,在4.2 K,0~8 T的磁场下测试线材的临界电流密度.测试结果显示,800 ℃烧结的Mg0.9Zr0.1B2/Fe/Cu线材获得了最高的临界电流密度.

参考文献

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