A Kind of homogeneous resin, which can be used as thermal resistant adhesive and matrix for composite,was prepared by bis(4-maleimidophenyl)methane (BMI), 4,4'-diaminodiphenylmethane(DDM), aniline(An), phenol type epoxy resin (F-51) and nitrile -butadiene rubber (NBR) through solution copolymerization. The reaction from prepolymerization to curing of the resin system was studied. And the factors such as raw material ratio and curing temperature, which affect thermal resistance and adhesives of cured product,were also analyzed. SEM and IR spectra were utilized to discuss the mechanisms of toughness and reaction of modified BMI.
参考文献
| [1] | Huang Zhixiong;Zhou Zufu.Composites of Unsaturated Polyester/Bismaleimide Copolymers[A].,1995:149-155. |
| [2] | Zhou Zufu;Huang Zhixiong.The Study of a Toughened Bismaleimide[A].Japan:The Adhesion Society of Japan,1995:411-421. |
| [3] | Jack d. Boyed.Bismaleimide Composites Advanced High-temperature Applications[A].,1993 |
| [4] | 郭丽玲,秦岩,黄志雄,周祖福,巫焕德.溶液聚合的BMI/DDM/ER体系贮存稳定性研究[J].武汉工业大学学报,1999(04):20-22. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%