针对微波电路芯片焊接脱落问题,分析了InPbAg合金焊点的微观结构及成分,研究了InPbAg焊料芯片焊接的失效模式.找出了芯片脱落的主要原因:金膜表面污染、划痕、浸润不良、焊接气氛保护不足及应力导致焊点的结合强度不够致使芯片脱落.根据分析提出了改进意见,较好地解决了InPbAg合金焊接芯片脱落问题,支撑了微波电路的生产工艺.
参考文献
| [1] | Wang C.Y.;Chen Y.C. .Directly deposited fluxless lead-indium-gold composite solder[J].IEEE transactions on components, hybrids, and manufacturing technology,1993(8):789-793. |
| [2] | 潘茹,李明娟,吴坚,刘英坤.半导体器件芯片焊接方法及控制[J].半导体技术,2006(04):272-275,279. |
| [3] | 王金城 .铅铟银合金失效分析[J].半导体技术,1995,6(03):36. |
| [4] | M.S. YEH .Effects of Indium on the Mechanical Properties of Ternary Sn-In-Ag Solders[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2003(2):361-365. |
| [5] | Scholz Christian;Boucke Konstantin;Poprawe Reinhart .Investigation of indium solder interfaces for high-power diode lasers[J].Proceedings of SPIE-The International Society for Optical Engineering,2003,4975:60. |
| [6] | El-Bediwi;Abu Bakr;El-Bahay M M .Influence of silver on structural,electrical,mechanical and soldering properties of tin-indium based alloys[J].Radiation Effects and Defects in Solids,2004,159(02):133. |
| [7] | Lee C.C.;Wang C.Y. .Au-In bonding below the eutectic temperature[J].IEEE transactions on components, hybrids, and manufacturing technology,1993(3):311-316. |
| [8] | 王铁兵,施建中,谢晓明.Au/In等温凝固焊接失效模式研究[J].功能材料与器件学报,2001(01):85-89. |
| [9] | Chien-Chih Liu;Yen-Kuang Lin;Mau-Phon Houng;Yeong-Her Wang .The Microstructure Investigation of Flip-Chip Laser Diode Bonding on Silicon Substrate by Using Indium-Gold Solder[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2003(3):635-641. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%