选用0.15 μm和5 μm的Al2O3颗粒,采用挤压铸造法制备了体积分数为40%的铝基复合材料.利用选区电子衍射和高分辨电子显微技术研究了Al2O3p/1070Al界面附近基体的显微组织.结果表明,复合材料增强体颗粒为5 μm时,基体存在大量的由热错配应力引发的位错,颗粒粒径为0.15 μm时,基体表现为近无位错的组织特征,其缺陷形式为1~5 nm的"微畸变区",这主要是由于粒径小、分布弥散,微区应力均匀所致.
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