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通过悬浮熔炼方法制备了Y1-x Tix NiSb(x=0,0.015,0.02,0.025)材料并研究了Ti掺杂对材料热电性能的影响.经过孔隙率修正后,Ti掺杂样品的热导率和电导率均比未掺杂样品要低,并且随着Ti含量的增加呈现先下降后上升的趋势.分析发现Ti掺杂后样品热导率的降低是由于电子热导率的下降所致,电子载流子的引入则导致了电导率的下降.Ti掺杂后样品Seebeck系数在室温下有变负趋势,表明材料在室温下可能呈现N型传导特性.最终,Ti掺杂提高了材料的热电性能.Ti含量x=0.015的样品在770K左右获得最大ZT值0.085,与未掺杂样品相比,提高了约60%.

参考文献

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