Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

材料科学技术（英文）, 2014, 30(9): 928-933.

Hao Zhang ^1, , Qing-Sheng Zhu ^2, , Zhi-Quan Liu ^3, , Li Zhang ^4, , Hongyan Guo ^5, , Chi-Ming Lai ^6,

1.Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

2.Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

3.Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

4.Jiangyin Changdian Advanced Packaging Co., Ltd., Jiangyin 214431, China

5.Jiangyin Changdian Advanced Packaging Co., Ltd., Jiangyin 214431, China

6.Jiangyin Changdian Advanced Packaging Co., Ltd., Jiangyin 214431, China

基金项目: We gratefully acknowledge the financial support from the Hundred Talents Program of the Chinese Academy of Sciences,the National Natural Science Foundation of China (Grant No.51101161),the National Basic Research Program of China (Grant No.2010CB631006),and the Major National Science and Technology Program of China (Grant No.2011ZX02602).

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

Keywords： Fe-Ni alloy

参考文献

[1]	N.DARIAVACH;P.CALLAHAN;J.LIANG .Intermetallic Growth Kinetics for Sn-Ag,Sn-Cu,and Sn-Ag-Cu Lead-Free Solders on Cu,Ni,and Fe-42Ni Substrates[J].Journal of Electronic Materials,2006(7):1581-1592.
[2]	P.J. Shang;Z.Q. Liu;X.Y. Pang .Growth mechanisms of Cu_3Sn on polycrystalline and single crystalline Cu substrates[J].Acta materialia,2009(16):4697-4706.

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Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

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