In this paper, a theoretical model was presented to simulate the stress-strain hysteresis and the inner hysteretic behaviors, which were observed for polycrystalline Ni-Ti and Cu-based shape memory alloys (SMAs) at various temperatures. It was assumed that the stress-strum hysteresis of the grains of a polycrystalline sample of SMAs was relatively simple and easy to be calculated. The texture of the sample was characterized by a distribution function, which could be obtained from the experiments. Thercfore,the model provided a means to simulate and, for the first time, to predict the stressstrain hysteresis at different loading temperatures for polycrystalline SMAs.
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