介绍了高纯球形纳米SiO2在电子封装材料中的应用,高纯球形纳米SiO2的优越特性(高介电、高耐热、高耐湿、高填充量、低膨胀、低应力、低杂质、低摩擦系数等)和作用.并归纳和评价了高纯球形纳米SiO2的制备方法,认为以水玻璃为基本原料,采用溶胶-凝胶法能制备出可应用于电子元器件塑封料填料的高纯球形纳米SiO2.
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