用电子探针分析了由电子束加热蒸发经水冷铜坩埚快冷的钛合金 TC4,TA7,TC9液面表层中合金元素Al,Sn,V,Si及 Mo的浓度分布。算出合金元素的活度系数:1921—2106℃,γ_(Al)=0.009—0.018,γ_(Sn)=0.066—0.123;2021℃,γv=0.713;1921℃,γ_(Si)=0.020,γ_(Mo)=0.913.结合有关合金元素蒸发激活能数据,讨论了合金元素Al,Sn,V,Si及Mo的蒸发速率控制阶段。
An EPMA was carried out of the concentration distribution of alloying eleme1ts,such as Al, Sn, V, Si and Mo, in surface layer of molten Ti alloy, TC4, TA7 or TC9, which was melted and evaporized by electron beam in water cooling copper crucible. The activity coefficient of the alloying elements was calculated as: γ_(Al)—0.009—0.018 and γ_(Sn)=0.066—0. 123 at 1921—2106℃, γ_v=0.713 at 2021℃, γ_(Si)=0.020, γ_(Mo)=0.913 at 1921℃. The controlling step of evaporation rate of the alloying element Al, Sn, V, Si or Mo was also discussed in the light of relevant evaporation activation energy of such alloying element.
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