综述了无机半导体颗粒填充聚合物复合材料的研究背景,重点介绍了填充半导体ZnO颗粒和SiC颗粒聚合物复合材料的导电特性,以及填充高介电常数BaTiO3颗粒聚合物复合材料的介电特性的研究进展,并介绍了这些材料在抑制电气绝缘材料老化问题方面的应用研究.
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