研究了不同配比的二乙烯基苯(DVB)/聚碳硅烷(PCS)热交联对陶瓷显微结构的影响.通过加热的方法调节体系粘度,满足了降低DVB配比条件下的交联工艺要求.结果表明:交联中适当地降低DVB配比,可增加交联产物的致密化程度,从而增加SiC陶瓷的致密化程度,有利于陶瓷显微结构的改善.
参考文献
| [1] | Hasegawa Y;Okamura K .Synthesis of continuous silicon carbide fiber,part 4:The structure of polycarbosilane as the precusor[J].Journal of Materials Science,1986,21(01):321-328. |
| [2] | 王建方,陈朝辉,郑文伟,肖加余,所俊.热压工艺在Cf/SiC复合材料制备中的应用[J].航空材料学报,2002(03):22-25. |
| [3] | 陈曼华,陈世乐,胡海峰,陈朝辉.二乙烯基苯/聚碳硅烷的配比与交联研究[J].宇航材料工艺,2003(03):49-52. |
| [4] | Dagmara Martysz;Milka Antoszczyszyn .Synthesis of 1ptopenyl ethers and their using as modifiers of UV-cured coating in radical and cationic polymerization[J].Progress in organic Coatings,2003,46:302-311. |
| [5] | Manisha Ganglani;Stephen H .Influenee of cure via network structure on mechanical properties of a free-radical polymerizing thermoset[J].POLYMER,2002,43:2747-2760. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%