研究了等温时效对Sn-3.5Ag共晶钎料及其复合钎料的力学性能和显微组织变化的影响.为了弥补传统复合钎料制备和服役中强化颗粒容易粗化的问题,制备了不同种类最佳配比的具有纳米结构的有机-无机笼型硅氧烷齐聚物(POSS)颗粒增强的Sn-Ag基复合钎料.对钎焊接头在不同温度(125、150、175℃)下进行时效,通过SEM和EDAX分析了钎料与基板间金属间化合物层(IMC)的生长情况.结果表明,经过不同温度时效,复合钎料钎焊接头界面处金属间化合物的生长速率比Sn-3.5Ag共晶钎料慢,复合钎料的IMC生长的激活能分别为80、97和77 kJ/mol,均高于Sn-3.5Ag共晶钎料.经过150℃时效1000 h后,复合钎料钎焊接头的剪切强度分别下降了22%、13%和18%,下降幅度相当或明显小于Sn-3.5Ag钎料钎焊接头.
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