采用电弧离子镀技术在YW2硬质合金基体上沉积了厚度为2μm的TiN涂层,对所获得的TiN/YW2体系进行了-196℃下30 h的深冷处理。采用X射线衍射仪（XRD）和显微硬度仪分别对深冷前后TiN涂层的相结构和硬度进行了检测,利用洛氏硬度仪采用压痕法研究了深冷处理前后YW2基体和TiN/YW2体系压痕形貌的变化,借助金相显微镜和扫描电镜（SEM）研究了基体显微组织及其对体系断裂韧性、界面结合状况的影响。结果表明：深冷处理后涂层中应力诱导晶粒扭转导致的TiN（111）面择优取向,使体系的硬度得到了提高。基体上压痕径向放射性裂纹密度明显降低,TiN涂层沿压痕周向的块状剥离得到缓解。深冷处理后弥散分布的颗粒状γ相显著减少或消失、孔隙率降低,组织变得更加致密,加之深冷处理过程中裂纹源的弥合,提高了YW2基体和TiN/YW2体系的断裂韧性和界面结合强度。
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