以硝酸银为主盐,磺基水杨酸为络合剂,醋酸铵和氨水为pH调节剂.研究了平均电流密度、脉冲宽度、占空比、溶液pH对镀层以及抗变色性能的影响;利用X-射线衍射分析研究了镀层结构.实验结果表明:常温下Jm=0.3 ～ 0.5 A/dm2,脉冲宽度为0.1 ～ 4 ms,占空比为5% ～ 25%,pH=8.8 ～ 9.3时,可以获得结合紧密、光亮细致的银镀层,且抗变色性能及耐腐蚀性均增强;X-射线衍射分析显示镀层主要成分是Ag.
参考文献
| [1] | Elkington G;Elkington H .Coating,covering or plating certain metals[P].GB 8447,1840-03-25. |
| [2] | 申雪花.无氰镀银工艺研究[J].科技咨询导报,2007(12):3-3. |
| [3] | 陈惠国.论电镀废水治理技术发展动态[J].电镀与环保,2001(03):32-35. |
| [4] | 周永璋.硫代硫酸钠无氰镀银[J].电镀与环保,2004(01):15-16. |
| [5] | Hradil E;Hradil H;Weisberg A M .Silver complex,method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys[P].US 4126524,1978-11-21. |
| [6] | Hradil E;Hradil H;Weisberg A M .Non-cyanide bright silver electroplating bath therefor,silver compounds and method of making silver compounds[P].US 4246077,1981-01-20. |
| [7] | Dini J W;Morrissey R J;Pacheco D R .Materials Characterization of a Non-Cyanide Silver Electrodeposit[J].Plating & Surface Finishing,1997,84(12):62-67. |
| [8] | Sriveeraraghavan S;Krishnan RM;Natarajan S R .Silver Electrodeposition from Thiosulfate Solutions[J].Metal Finishing,1989,87(06):115-117. |
| [9] | Kondo T;Masaki S;Inoue H et al.Silver Plating from Silver Methanesulfonate-Potassium Iodide Bath[J].Metal Finishing,1991,89(10):32-36. |
| [10] | Sobha Jayakrishnan;S.R. Natarajan;K.I. Vasu .Alkaline Noncyanide Bath for Electrodeposition of Silver[J].Metal finishing,1996(5):12,14-15-0. |
| [11] | S. Masaki;H. Inoue;H. Honma .Mirror-bright silver plating from a cyanide-free bath[J].Metal finishing,1998(1A):16-20. |
| [12] | 吴水清 .镀银溶液中的有机添加剂[J].五金科技,1996,24(06):25. |
| [13] | 电子工业技术动态编辑组.电子工业技术动态增刊[M].电子工业部科技情报研究所,1973(03):44. |
| [14] | Vitanov T;Popov A;Budevski E .Mechanism of electrocrystallization[J].Electrochemical Science and Technology,1974,121(21):207-212. |
| [15] | 刘仁志.无氰镀银的工艺与技术现状[J].电镀与精饰,2006(01):21-24. |
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