为提高Ni-Cu-P合金镀层的耐腐蚀性,采用正交试验法对NdFeB磁体表面化学镀Ni-Cu-P合金的镀液配方和施镀工艺进行优化,获得NdFeB磁体表面化学镀Ni-Cu-P合金的最佳成分配方为:硫酸镍25g/L,硫酸铜0.4 g/L,次亚磷酸钠35 g/L,络合剂48 g/L,缓冲剂50 g/L,pH值9.分析镀液pH值和镀液中CuS04·5H20浓度对沉积速度和镀层成分的影响.结果表明:随镀液pH值增加,沉积速度提高,镀层中Cu和Ni含量略升高,P含量逐渐降低；随镀液中CuS04·5H20浓度的增加,镀层中Cu含量升高,P含量先升高后降低,Ni含量降低.
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