采用四针状氧化锌晶须（ZnOw）和石墨烯纳米片（GNP）改性氰酸酯树脂（CE）制备了系列导热绝缘复合材料，研究了填料的种类和用量对氰酸酯复合材料导热、绝缘及热稳定性能的影响。当树脂基体中加入50％ ZnOw或10％ GNP时，复合材料的热导率分别达到07．7和09．7W／（m·K），较纯树脂基体材料分别提高了185％和259％。将Z n O w与G N P混合填充氰酸酯树脂则更有利于提高复合材料的导热性能，当树脂基体中加入40％ ZnOw 和10％ GNP混合填料时，复合材料的热导率可达到15．4 W／（m·K），较纯树脂基体材料提高了470％，并且该复合材料仍能够保持良好的电绝缘性能。TGA结果表明，石墨烯纳米片和氧化锌晶须的加入可以明显提高氰酸酯树脂复合材料的热稳定性。
A series of thermally conductive cyanate ester resin (CE) composites filled with tetrapod‐shaped zinc oxide whiskers (ZnOw) and graphene nanoplatelets (GNP) were prepared .Effects of the varieties and amounts of the fillers on thermal conductivity ,electrical insulation and thermal stability properties of the composites were investigated .By adding 50% ZnOw or 10% GNP to cyanate ester resin ,the thermal conductivity of the composites reached 0 7.7 and 0 .97 W/(m · K) ,which were respectively 185% and 259% higher than that of pure CE matrix .Incorporating the mixture of ZnOw and GNP into cyanate ester resin could facilitate to improve the thermal conductivity of the composites .The thermal conductivity of the CE composite is as high as 1 5.4 W/(m · K) with 40% ZnOw and 10% GNP ,which is 470% higher than that of pure CE matrix ,while its better e‐lectrical insulation is maintained .TGA results showed that the addition of graphene nanoplatelets and zinc oxide whiskers can improve the thermal stability of CE composites significantly .
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