采用不同退火温度对室温轧制的Ag/Cu复合板材进行了扩散处理，测定了界面的结合强度及基体硬度，观察了微观组织形态。结果指出，由于扩散处理可以改变界面结合状态和界面附近组织的局部应变能力，因而可以使结合强度发生显著变化。400℃退火的扩散处理可使结合强度升高至最高值，再继续升高退火温度，结合强度下降。若退火温度超过共晶温度，则结合强度可再次升高。结合面两侧基体硬度随退火温度升高而下降。当退火温度高于600℃后，结合面Ag侧出现细晶区。扩散处理温度升高，结合面两侧晶粒均明显增大，其中Ag侧晶粒的增大更为明显。
Cu-Ag bimetallic sheets by cold roll cladding have been treated by diffusion annealing in the temperature range 250-800℃.Interface bonding level and hardness in matrix copper and silver have been determined and microstructure in interface region has been observed.The interface bonding level is essentially improved as annealing at 400℃ or 800℃. High diffusion temperature results in hardness reduction in the strips. Recrystallization just starts in the strips annealed at 250℃ and mainly emerges at 400℃.Annealing above 600℃ can produce the fine grain areas between interface and silver matrix. If diffusion treatment induces the recovery or recrystallization or the fusion of partial bonding interface, the interface bonding level can be enhanced.
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