使用高倍电子显微镜分析了钼铜合金的微观结构，此种合金是把机械活化处理后的钼、铜粉末，通过液相烧结制成的，这种合金是目前集成电路急需的热耗散材料。微观分析表明：钼铜合金具有均匀分布的钼、铜两相组织，钼晶粒多为条状，被铜完全包裹的单个卵形钼晶粒较少存在。钼晶粒与铜相之间存在宽度为10～20nm的过渡区。也讨论了具有这种微观结构合金的一些性能。
The micro-structural evolution in Mo-Cu alloy has been investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Mo-Cu alloy was made through liquidphase sintering of powders of Mo and Cu milled by mechanical activation,which is used for heat dissipation in high performance microelectronic circuits. The micro-structural characterization of Mo-Cu alloy is homogeneous compound structure of adhesive phase Cu linked with Mo grains. Mo grains frequently string together. There is little ellipsoidal Mo grains singly existed around by Cu phase. Between Mo grains and Cu zone,there is a medium changing zone,a width of 10～20nm. Its thermal expansivity and other properties are also presented and discussed.
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