从铜箔表面处理、聚酰亚胺薄膜表面处理与改性及其本体分子结构设计三方面综述了改善二层无胶型挠性覆铜板的研究进展,并对其进行了展望.
参考文献
| [1] | 中国电子学会生产技术学会分会专家.挠性印制板生产技术[M].中国香港:香港盈拓科技咨询服务有限公司,2004 |
| [2] | 刘生鹏.浅述二层挠性覆铜板的进展及市场分布[J].印制电路信息,2007(05):42-44. |
| [3] | Jung-ok Baek;Sun-joo Park;Hui-jin Gong;Wonho Kim .Polyurethane Modified Epoxy Adhesives for the Application to FCCL[J].Macromolecular symposia,2007(0):654-659. |
| [4] | 余凤斌,陈莹,夏祥华,朱德明.二层型聚酰亚胺薄膜挠性覆铜板的制备与分析[J].绝缘材料,2008(04):6-8. |
| [5] | 张翔宇,梁立,茹敬宏,伍宏奎,刘生鹏,鹿海华.二层法双面挠性覆铜板的研制[J].绝缘材料,2009(06):9-11. |
| [6] | 杨培发,严辉,范和平.二层柔性覆铜板用聚酰亚胺研究进展[J].绝缘材料,2006(03):27-31,35. |
| [7] | Strunskus T;Grunze M;Kochendoerfer G et al.Identification of Physical and Chemical Interaction Mechanisms for the Metals Gold,Silver,Copper,Palladium,Chromium,and Potassium with Polyimide Surfaces[J].Langmuir,1996,12(11):2712-2725. |
| [8] | Haight R;White R C;Silverman B D et al.Complex Formation and Growth at the Cr-and Cu-polyimide Interface[J].Journal of Vacuum Science and Technology A:Vacuum Surfaces and Films,1988,6(04):2188-2199. |
| [9] | White R C;Haight R;Silverman B D et al.Cr-and Cu-polyimide Interface:Chemistry and Structure[J].Applied Physics Letters,1987,51(07):481-483. |
| [10] | 刘书祯.印制电路板用铜箔的表面处理[J].电镀与精饰,2008(02):17-20,23. |
| [11] | Lee CY;Moon WC;Jung SB .Surface finishes of rolled copper foil for flexible printed circuit board[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(0):723-726. |
| [12] | BO-IN NOH;SEUNG-BOO JUNG .Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate[J].Journal of Electronic Materials,2009(1):46-53. |
| [13] | Lee K W;Walker G F;Viehbeck A .Formation of Polyimide-Cu Complexes:Improvement of Direct Cu-on-PI and PI-on-Cu Adhesion[J].Journal of Adhesion Science and Technology,1995,9:1125-1141. |
| [14] | Kim H.;Jang J. .Corrosion protection and adhesion promotion for polyimide/copper system using silane-modified polymeric materials[J].Polymer: The International Journal for the Science and Technology of Polymers,2000(17):6553-6561. |
| [15] | Eom, JS;Kim, SH .Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate[J].Thin Solid Films,2008(14):4530-4534. |
| [16] | Yang CH;Lee SC;Wu JM;Lin TC .The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2005(5):1818-1825. |
| [17] | Kim SH;Cho SH;Lee NE;Kim HM;Nam YW;Kim YH .Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma[J].Surface & Coatings Technology,2005(1/3):101-106. |
| [18] | Dong-Hee Park;Won-Kook Choi .Low energy O_2~+ and N_2O~+ ion beam modification of polyimide for improving adhesive strength of Cu/PI in roll-to-roll process[J].Thin Solid Films,2009(14):4222-4225. |
| [19] | Chang G S;Jung S M;Lee Y S et al.Adhesion Enhancement of Ion beam Mixed Cu/Al/polyimide[J].Journal of Applied Physics,1997,81(01):135-138. |
| [20] | Xue G;Dai Q;Jiang S .Chemical Reactions of Imidazole with Metallic Silver Studied by the Use of SERS and XPS Techniques[J].Journal of the American Chemical Society,1988,110(08):2393-2395. |
| [21] | Xue G;Ding J;Lu P et al.SERS,XPS,and Electroanalytical Studies of the Chemisorption of Benzotriazole on a Freshly Etched Surface and an Oxidized Surface of Copper[J].Journal of Physical Chemistry,1991,95(19):7380-7384. |
| [22] | Chan Park M B;Tan S S .Thermal Graft Copolymerization of 4-vinyl Pyridine on Polyimide to Improve Adhesion to Copper[J].International Journal of Adhes,2002,22(06):471-475. |
| [23] | Inagaki N.;Masumoto M.;Tasaka S. .IMPROVED ADHESION BETWEEN KAPTON FILM AND COPPER METAL BY PLASMA GRAFT POLYMERIZATION OF VINYLIMIDAZOLE[J].Macromolecules,1996(5):1642-1648. |
| [24] | Yang G R;Shen H;Li C et al.Study of Metal-polymer Adhesion-A New Technology:Cu Plasma PIB[J].Journal of Electronic Materials,1997,26(02):78-82. |
| [25] | Wang WC.;Kang ET.;Neoh KG. .Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2002(1/4):52-66. |
| [26] | Wang W C;Vora R H;Kang E T et al.Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-vinylimidazole and 4-vinylpyridine[J].Polymer Engineering and Science,2004,44(02):362-375. |
| [27] | Hwa Jin Kim;Yun Jun Park;Jong-Ho Choi .Surface modification of polyimide film by coupling reaction for copper metallization[J].Journal of industrial and engineering chemistry,2009(1):23-30. |
| [28] | Miwa T;Tawata R;Numata S .Relationship Between Structure and Adhesion Properties of Aromatic Polyimides[J].Polymer,1993,34(03):621-624. |
| [29] | Chen K M;Ho S M;Wang T H et al.Studies on the Adhesion of Polyimide Coatings on Copper Foil[J].Journal of Applied Polymer Science,1992,45(06):947-956. |
| [30] | Satoru Iwamori;Takehiro Miyashita;Shin Fukuda;Shouhei Nozaki;Kazufuyu Sudoh;Nobuhiro Fukuda .Effect of an interfacial layer on adhesion strength deterioration between a copper thin film and polyimide substrates[J].Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology,1998(4):615-618. |
| [31] | Iwamori S;Miyashita T;Fukuda S et al.Changes in the Adhesion Strength Between Copper Thin Films and Polyimide Substrates After Heat Treatment[J].Journal of Adhesion Science and Technology,1997,11:783-795. |
| [32] | Chen H L;Ho S H;Wang T H et al.Curl-free High-adhesion Polyimide/copper Laminate[J].Journal of Applied Polymer Science,1994,51(09):1647-1652. |
| [33] | Im Sik Chung;Chan Eon Park;Moonhor Ree .Soluble Polyimides Containing Benzimidazole Rings for Interlevel Dielectrics[J].Chemistry of Materials,2001(9):2801-2806. |
| [34] | Jeonghoon Seo;Jeonghoon Kang;Kilwon Cho;Chan Eon Park .Synthesis of polyimides containing triazole to improve their adhesion to copper substrate[J].Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology,2002(13):1839-1851. |
| [35] | CHUN-KANG KU;CHANG-HONG HO;YU-DER LEE .Synthesis of polyimides containing pyridine or triazole moiety to improve their adhesion to sputter-deposited copper[J].Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology,2005(11):909-925. |
| [36] | 古俊纲 .应用于无接着剂型软性铜箔基板之新型聚酰亚胺[D].中国台湾:台湾清华大学,2007. |
| [37] | 庄永兵,顾宜.高性能聚酰亚胺薄膜及其无胶型挠性覆铜板的研究[C].第十届中国覆铜板市场·技术研讨会论文集,2009:134-136. |
| [38] | 顾宜;庄永兵;刘向阳 等.无卷曲高粘接无胶型挠性覆铜板的制备方法[P].CN,101695222A,2010-04-14. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%