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随着集成电路的不断发展,电路中互连线规模越来越大,尺寸越来越小,需要承受的电流密度越来越大.在这种趋势下,传统的铜互连线的有效性和可靠性都随之变差.由于碳纳米管具有良好的电学,热学和机械性能,使其成为目前研究较热的互连材料之一.本文概述了碳纳米管用于集成电路互连的优势,碳纳米管互连的电路模型,碳纳米管互连面临的挑战及其最新的研究进展,并展望了碳纳米管作为集成互连的研究前景.

参考文献

[1] International Technology Roadmap for Semiconductors[OL].http://public.itrs.net/,2009.
[2] R.H.Baughman;A.A.Zakhidov;W.A.de Heer .Carbon nanotubes-the route toward applications[J].Science,2002,297(5582):787-792.
[3] W.Steinhogl;G.Schindler;M.Engelhardt .Size-dependent resistivity of metallic wires in the mesoscopic range[J].Physical Review B:Condensed Matter,2002,66(07):075414-1-4.
[4] Changsup Ryu;Kee-Won Kwon;Alvin L. S. Loke;Haebum Lee;Takeshi Nogami;Valery M. DubinRahim A. Ka .Microstructure and reliability of copper interconnects[J].IEEE Transactions on Electron Devices,1999(6):1113-1120.
[5] Li, H.;Xu, C.;Srivastava, N.;Banerjee, K. .Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects[J].IEEE Transactions on Electron Devices,2009(9):1799-1821.
[6] Ji-Yong Park;Sami Rosenblatt;Yuval Yaish;Vera Sazonova;Hande Ustunel;Stephan Braig;T. A. Arias;Piet W. Brouwer;Paul L. McEuen .Electron-Phonon Scattering in Metallic Single-Walled Carbon Nanotubes[J].Nano letters,2004(3):517-520.
[7] Sayeef Salahuddin;Mark Lundstrom;Supriyo Datta .Transport Effects on Signal Propagation in Quantum Wires[J].IEEE Transactions on Electron Devices,2005(8):1734-1742.
[8] Wei.B.Q;Vajtai.R;Ajayan.P.M .Reliability and current carrying capacity of carbon nanotubes[J].Applied Physics Letters,2001,79(08):1172-1174.
[9] F.Y.Meng;Shigenobu Ogata;D.S.Xu et al.Thermal conductivity of an ultrathin carbon nanotube with an Ⅹ-shaped junction[J].Physical Review B,2007,75:205403-1-6.
[10] Eric Pop;David Mann;Qian Wang;Kenneth Goodson;Hongjie Dai .Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature[J].Nano letters,2006(1):96-100.
[11] K.Liu;P.Avouris;R.Martel;W.K.Hsu .Electrical transport in doped multiwalled carbon nanotubes[J].Physical Review B,2001,63:161404-1-4.
[12] H. J. Li;W. G. Lu;J. J. Li;X. D. Bai;C. Z. Gu .Multichannel Ballistic Transport in Multiwall Carbon Nanotubes[J].Physical review letters,2005(8):086601.1-086601.4.
[13] Close GF;Yasuda S;Paul B;Fujita S;Wong HSP .A 1 GHz integrated circuit with carbon nanotube interconnects and silicon transistors[J].Nano letters,2008(2):706-709.
[14] Raychowdhury A.;Roy K. .Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies[J].IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems: A publication of the IEEE Circuits and Systems Society,2006(1):58-65.
[15] Anantram MP;Leonard F .Physics of carbon nanotube electronic devices[J].Reports on Progress in Physics,2006(3):507-561.
[16] Li, H.;Banerjee, K. .High-Frequency Analysis of Carbon Nanotube Interconnects and Implications for On-Chip Inductor Design[J].IEEE Transactions on Electron Devices,2009(10):2202-2214.
[17] N.Srivastava;R.V.Joshi;K.Banerjee.Carbon nanotube interconnects: Implications for performance,power dissipation and thermal management[A].Washington,DC,2005:249-252.
[18] Awano Y;Sato S;Kondo D;Ohfuti M;Kawabata A;Nihei M;Yokoyama N .Carbon nanotube via interconnect technologies: size-classified catalyst nanoparticles and low-resistance ohmic contact formation[J].Physica Status Solidi, A. Applied Research,2006(14):3611-3616.
[19] Z.Liu;L.Ci;S.Kar et al.Fabrication and electrical characterization of densified carbon nanotube micropillars for IC interconnection[J].IEEE Transactions on Nanotechnology,2009,8(02):196-203.
[20] Teng Wang;Kjell Jeppson;Johan Liu .Dry densification of carbon nanotube bundles[J].Carbon: An International Journal Sponsored by the American Carbon Society,2010(13):3795-3801.
[21] Preferential Growth of Single-Walled Carbon Nanotubes with Metallic Conductivity[J].Science,2009(Oct.2 TN.5949):116.
[22] B.Q.Wei;R.Vajtai;Y.Jung et al.Microfabrication technology:Organized assembly of carbon nanotubes[J].Nature,2002,416:495-496.
[23] Zhang C;Cott D;Chiodarelli N;Vereecken P;Robertson J;Whelan CM .Growth of carbon nanotubes as horizontal interconnects[J].Physica status solidi, B. Basic research,2008(10):2308-2310.
[24] Huijun Xin;Adam T.Woolley .Directional Orientation of Carbon Nanotubes on Surfaces Using a Gas Flow Cell[J].Nano letters,2004(8):1481-1484.
[25] Yuki Matsuda;Wei-Qiao Deng;William A. Goddard III .Contact Resistance for "End-Contacted" Metal-Graphene and Metal-Nanotube Interfaces from Quantum Mechanics[J].The journal of physical chemistry, C. Nanomaterials and interfaces,2010(41):17845-17850.
[26] Changxin Chen;Liyue Liu;Yang Lu .A method for creating reliable and low-resistance contacts between carbon nanotubes and microelectrodes[J].Carbon: An International Journal Sponsored by the American Carbon Society,2007(2):436-442.
[27] Daisuke Yokoyama;Takayuki Iwasaki;Tsuyoshi Yoshida;Hiroshi Kawarada;Shintaro Sato;Takashi Hyakushima;Mizuhisa Nihei;Yuji Awano .Low temperature grown carbon nanotube interconnects using inner shells' by chemical mechanical polishing[J].Applied physics letters,2007(26):263101.1-263101.3.
[28] Seong Chu Lim;Jin Ho Jang;Dong Jae Bae;Gang Hee Han;Sunwoo Lee;In-Seok Yeo;Young Hee Lee .Contact resistance between metal and carbon nanotube interconnects: Effect of work function and wettability[J].Applied physics letters,2009(26):264103-1-264103-3.
[29] Chun Lan;Placidus B. Amama;Timothy S. Fisher;Ronald G. Reifenberger .Correlating electrical resistance to growth conditions for multiwalled carbon nanotubes[J].Applied physics letters,2007(9):093105-1-093105-3-0.
[30] Jeff T. H. Tsai;Anders A. Tseng .Defect reduction of multi-walled carbon nanotubes by rapid vacuum arc annealing[J].Journal of Experimental Nanoscience,2009(1):87-93.
[31] N G Shang;Y Y Tan;V Stolojan et al.High-rate low-temperature growth of vertically aligned carbon nanotubes[J].Nanotechnology,2010,21:505604-505609.
[32] J Li Jun;Ye Qi;Cassell Alan et al.Bottom-up approach for carbon nanotube interconnects[J].Applied Physics Letters,2003,82(15):2491-2493.
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