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采用瞬间蒸发技术沉积了厚度为800 nm的P型Bi0.5Sb1.5Te3热电薄膜,并在373 K-573 K进行1小时的真空退火处理.利用X射线衍射(XRD)、场发射扫描电子显微镜(FESEM)和能量散射谱(EDS)分别对薄膜的物相结构、表面形貌以及化学计量比进行表征.研究了退火温度对Bi0.5Sb1.5Te3薄膜的电阻率和Seebeck系数的影响,退火温度从373K增加到473K,Bi0.5Sb1.5Te3薄膜的电阻率和Seebeck系数都随之增加,退火温度从523K增加到573K,薄膜的电阻率和Seebeck系数缓慢下降.当退火温度为473K时,Bi0.5Sb1.5Te3薄膜的电阻率和Seebeck系数分别为2.1 mΩcm和162 μV/K,薄膜的热电功率因子最大值为13 μW/cmK2.

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