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本文提出了一种简易、低成本的钨丝微电极阵列制作工艺和方法.该方法采用MEMS工艺制作的玻璃模具实现钨丝阵列的精密有序排列,同时,在钨丝电极表面涂覆一层光敏性的聚酰亚胺作为绝缘层,结合"双面光刻"技术和电化学腐蚀技术实现电极位点大小和电极丝几何尺寸的精确控制.最后,通过注模、光刻制作SU-8固定座体完成钨丝微电极阵列的组装固定.整个制作工艺简单快速,且玻璃模具可重复使用,大大降低了制作成本.此外,本文还测试和评价了所制作微电极的表面形貌、电学性能以及生物相容性.

参考文献

[1] 周洪波,李刚,金庆辉,赵建龙.神经工程系统中的微电极技术[J].微纳电子技术,2006(11):535-540,545.
[2] Stieglitz T;Meyer JU .Implantable microsystems.Polyimide-based neuroprostheses for interfacing nerves[J].Medical Device Technology,1999,10(06):28-30.
[3] 周洪波,李刚,张华,孙晓娜,姚源,金庆辉,赵建龙,任秋实.简易低成本柔性神经微电极制作方法[J].光学精密工程,2007(07):1056-1063.
[4] 周洪波,李刚,金庆辉,赵建龙,任秋实.植入式双面柔性神经微电极制作方法的研究[J].微细加工技术,2007(03):54-59.
[5] Stieglitz T;Schuttler M;Keller R et al.Micromachined cuff electrodes for recording and stimulation[J].Medical and Biological Engineering and Computing,1999,37:1100.
[6] Rodriguez FJ;Ceballos D;Schuttler M;Valero A;Valderrama E;Stieglitz T;Navarro X .Polyimide cuff electrodes for peripheral nerve stimulation.[J].Journal of Neuroscience Methods,2000(2):105-118.
[7] Stieglitz T.;Ruf HH.;Gross M.;Schuettler M.;Meyer JU. .A biohybrid system to interface peripheral nerves after traumatic lesions: design of a high channel sieve electrode[J].Biosensors & Bioelectronics: The International Journal for the Professional Involved with Research, Technology and Applications of Biosensers and Related Devices,2002(8):685-696.
[8] Akin T.;Najafi K.;Smoke R.H.;Bradley R.M. .A micromachined silicon sieve electrode for nerve regeneration applications[J].IEEE Transactions on Biomedical Engineering,1994(4):305-313.
[9] Campbell P.K.;Jones K.E. .A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array[J].IEEE Transactions on Biomedical Engineering,1991(8):758-768.
[10] Bai Q.;Anderson DJ.;Wise KD. .A high-yield microassembly structure for three-dimensional microelectrode arrays[J].IEEE Transactions on Biomedical Engineering,2000(3):281-289.
[11] Norlin P.;Kindlundh M.;Mouroux A.;Yoshida K.;Hofmann UG. .A 32-site neural recording probe fabricated by DRIE of SOI substrates[J].Journal of Micromechanics and Microengineering,2002(4):414-419.
[12] Motta P.S.;Judy J.W. .Multielectrode microprobes for deep-brain stimulation fabricated with a customizable 3-D electroplating process[J].IEEE Transactions on Biomedical Engineering,2005(5):923-933.
[13] Jeyakumar Subbaroyan;David C Martin;Daryl R Kipke .A finite-element model of the mechanical effects of implantable microelectrodes in the cerebral cortex[J].Journal of neural engineering,2005(4):103-113.
[14] Franks W;Schenker I .Impedance Characterization and Modeling of Electrodes for Biomedical Applications.Biomedical Engineering[J].IEEE Transactions,2005,52(07):1295-1302.
[15] Kindlundh M;Norlin P .A gel-based wafer-level testing procedure for microelectrodes[J].Sensors and Actuators, B. Chemical,2005(2):557-562.
[16] Shane AR .Effectiveness of cleaning surgical implants:Quantitative analysis of contaminant removal[J].Journal of Applied Biomateriais,1995,6(01):1-7.
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