对超大规模集成电路铝互连系统中的铝通孔电迁移进行了试验分析和模拟.以通孔开路为电迁移失效判据,求出了在加速条件下互连铝通孔的电迁移寿命;基于ANSYS模拟软件平台,对铝通孔电迁移热电耦合效应进行了模拟.仿真结果表明通孔最高温度比环境温度高出9.576K,与通孔自热效应理论模型算出的结果基本一致.考虑该温度修正后通孔电迁移寿命与实际值更接近.该工作对铝通孔电迁移的研究和寿命评价具有重要的实际意义.
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