合成了两种分别含有叔酯键和叔醚键的环氧化合物EP-1和EP-2,其结构通过红外光谱、氢核磁共振谱及环氧当量测定等方法得到证实.EP-1与已有商品ERL-4221以环氧物质的量比1:1混合组成EP-3.EP-2和EP-3用酸酐类固化剂HMPA固化.TGA测试表明它们具有理想的起始热分解温度(IDT=210～220℃),显著低于现在普遍应用的环氧底部填充料ERL-4221(IDT=310℃).它们的粘结强度和玻璃化转变温度Tg在返工温度(225℃)老化数分钟后迅速降低,可以满足当前微电子倒装芯片封装对可返修工艺的要求.
参考文献
| [1] | Tummala R R;Rymaszewski E J;Klopfenstein A.Microelectronics packaging handbook[M].New York,NY:Chapman & Hall,Ch.1,1997:76. |
| [2] | Wada M.[A].San Diego CA,1999:56. |
| [3] | Feustel F;Eckebracht A.Proceedings of the 49th Electronic components and technology conference (ECTC)[M].San Diego CA,1999:583. |
| [4] | Yang S.;Korner H.;Breiner T.;Ober CK.;Poliks MD.;Chen JS. .Reworkable epoxies: Thermosets with thermally cleavable groups for controlled network breakdown[J].Chemistry of Materials,1998(6):1475-1482. |
| [5] | Wang L;Wong CP .Synthesis and characterizations of thermally reworkable epoxy resins part Ⅰ[J].Journal of Polymer Science Part A:Polymer Chemistry,2000,37:2991-3001. |
| [6] | Wang L;Li H;Wong CP .Syntheses and characterizations of thermally reworkable epoxy resins part Ⅱ[J].Journal of Polymer Science Part A:Polymer Chemistry,2000,38:3771-3782. |
| [7] | Wang ZG;Xie MR;Zhao YF et al.Synthesis and properties of novel liquid ester-free reworkable cycloaliphatic diepoxides for electronic packaging application[J].Polymer,2003,44:923-926. |
| [8] | Lawrence Crane;Afranio Torres-Filho;Christopher K. Ober;Shu Yang;Jir-Shyr Chen;R. Wayne Johnson .Development of reworkable underfills, materials, reliability and processing[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,1999(2):163-167. |
| [9] | Jahn H;Goetzky P.Chemical analysis of epoxides and epoxy resins In:May CA,ed Epoxy Resins[M].New York and Basel:Marcel Dekker Inc,1988:1049-1087. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%