通过对SnAgCu(SnPb)/Ni和SnAgCu(SnPb)/Cu 界面热冲击过程中金属间化合物(Intermetallic compound,IMC)生长规律的研究,以期更好的了解SnAgCu 无铅焊料与Ni或Cu金属化层的相互匹配.结果表明固溶在焊料中的Cu或者Ni影响热冲击过程中界面IMC的演化.采用NiAu 镀层时,IMC的生长速率比HASL(Hot Air Solder Level)镀层慢,并且界面没有Kirkendall孔洞生成,所以有更好的长期可靠性.采用SnAgCu 焊料时,界面Kirkendall孔洞较SnPb焊料少,界面IMC的生长速率较SnPb焊料慢.
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