对含乙烯基陶瓷前驱体PSN1的固化工艺及其经准陶瓷化后所得材料的性能进行了研究.采用TGA、DMA对准陶瓷基体的热性能进行了表征.结果表明:其分解温度及800℃残重率随准陶瓷化温度升高而升高,N2气氛下分别达到580℃和87%,空气气氛中分解温度高于550℃,残重率达95%以上,Tg也随准陶瓷化温度上升而升高,420℃准陶瓷化基体在400℃以下没有明显的玻璃化转变.运用网络矢量分析仪测定了介电常数随温度和频率的变化情况,结果表明准陶瓷基体介电常数小于3,并且随温度和频率变化不大.准陶瓷基体吸水率较低,最低达到0.03%.初步研究表明PSN1准陶瓷基体具有良好的热、介电稳定性,吸水率低,有望用作耐高温透波复合材料基体.
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