研究了不同温度对高硅氧/有机硅复合材料弯曲性能的影响；采用红外光谱仪对甲基苯基硅树脂在室温～600℃的结构进行了表征；使用热重分析仪,对基体树脂的热稳定性进行了测量；通过动态热机械分析仪对复合材料的动态力学性能进行了测定；采用扫描电镜对复合材料弯曲断口的形貌进行了观察.,结果表明,室温～ 600℃范围内弯曲强度随温度的升高而降低,弯曲强度在200℃,300℃,600℃分别出现了明显的降低.复合材料的玻璃化转变、树脂分解和裂解是弯曲性能下降的主要原因.
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