采用气压成形方法对多层板结构件进行了超塑成形/扩散连接(SPF/DB)技术研究.研究表明,最佳的扩散连接工艺参数为:连接温度T=930℃,连接时间t=30min,连接压力P=10MPa.对连接试件的微观组织进行了观察,显示在界面处形成良好的连接.最佳的成形参数为:成形温度Tf=930℃,成形压力Pf=0.6MPa,成形时间tf=55min.最后对成形后的板厚分布进行了研究.
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