采用先驱体浸渗热解法制备了3D NextelTM 720/Mullite复合材料,并对基体的组分控制、复合材料致密化以及热处理温度对复合材料强度的影响进行了研究.结果表明,采用正硅酸已酯和异丙醇铝作为先驱体可以在相对低温(≤1200℃)通过循环浸渗热解制备孔隙率低于20%的复合材料.
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