采用类似于粉未冶金工艺制备了体积分数为30%的Ba2ti9O20/PTFE微波基片复合材料.通过三点弯曲法及介电测试系统研究了复合材料的力学与介电性能.发现在310～340℃范围内,随烧结温度升高,复合材料的抗弯强度和弹性模量升高,在烧结温度为370℃时达到峰值,分别为:19.8 MPa、3.7 GPa.复合材料的介电常数和介电损耗具有良好的频率和温度稳定性.
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