采用RF磁控溅射技术制备了TiNi(1-x) Cux合金薄膜,利用扫描电镜、电子能谱仪和XRD技术分析研究了RF磁控溅射工艺对TiNi(1-x)Cux合金薄膜组织形貌的影响规律.结果表明:在基片不加热的条件下溅射薄膜组织结构为非晶,并呈柱状形貌垂直于基片生长;经650～720℃,3 min退火处理后,薄膜均发生晶化转变;在他它条件相同的情况下,溅射功率和工作气压对薄膜组织形貌有很大影响;薄膜的柱状单胞直径、薄膜厚度和生长速度均随溅射功率的增长而增长,但当溅射功率一定时,工作气压增加使柱状单胞直径、薄膜厚度和薄膜的生长速率显著减小;RF磁控溅射过程中,沉积原子的活性及其沉积速率是影响薄膜组织形貌的主要原因.
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