介绍了近年来国内外在化学镀Ni-Sn-P合金镀层方面的研究进展,探讨了镍盐含量、锡盐含量、还原剂含量、络合剂含量、温度和pH等因素对化学镀Ni-Sn-P合金的镀速及镀层质量的影响.分析了镀层的表面形貌、结构及性能,概述了化学镀Ni-Sn-P合金镀层的应用及目前所存在的问题.
参考文献
| [1] | 林忠华,林琳,杜金辉.化学镀Ni-Sn-P合金镀层的研究与应用[J].电镀与涂饰,2005(07):8-12. |
| [2] | D. Tachev;J. Georgieva;S. Armyanov .Magnetothermal study of nanocrystalline particle formation in amorphous electroless Ni-P and Ni-Me-P alloys[J].Electrochimica Acta,2001(1/2):359-369. |
| [3] | SCHMITT G;SCHMELING E .Properties of chemically deposited Ni-Sn-P polyalloys[J].Metalloberflache,1993,47(10):493-496. |
| [4] | BIELINSKI J;SKUDLARSKA E .Buffer and complex former in the process of external electroless Ni-Mo-P precipitation[J].Oberflache Surf,1985,26(03):76-82. |
| [5] | 李宁;袁国伟;黎德育.化学镀镍基合金理论与技术[M].哈尔滨:哈尔滨工业大学出版社,2000:171. |
| [6] | BIELINSKI J;JAWORSKA A .Electroless deposition of Ni-Sn-P alloys from citrate bath[J].Inzynieria Powierzchni,2005,23(01):36-42. |
| [7] | Xie Haowen;Zhang Bangwei .Preparation, structure and corrosion properties of electroless amorphous Ni-Sn-P alloys[J].Transactions of the Institute of Metal Finishing,1999(5):99-102. |
| [8] | 闫洪 .陶瓷表面化学镀Ni-Sn-P合金[J].上海微电子技术和应用,1996,24(02):36-39. |
| [9] | 王红艳;叶向荣;刘琴 等.钢铁表面Ni-Sn-P合金镀层组成及其耐蚀性[J].应用化学,1999,16(05):45-48. |
| [10] | 姜晓霞;沈伟.化学镀理论及实践[M].北京:国防工业出版社,2000:27. |
| [11] | 宋长生.化学镀Ni-Sn-P合金的工艺研究（I）[J].电镀与精饰,1996(04):10. |
| [12] | LEE C Y;LIN K L .Wetting kinetics and the interfacial interaction behavior between electroless Ni-Sn-P and molten solder[J].Japanese Journal of Applied Physics,2000,33(05):2684-2688. |
| [13] | 伍学高;李铭华;黄渭成.化学镀技术[M].成都:四川科学技术出版社,1985:203. |
| [14] | 邹坚.HEDP酸性化学镀Ni-P合金工艺[J].材料保护,1992(01):33. |
| [15] | 陈菊香;黎永钧 .化学镀镍与络合物[J].电镀与环保,1992,12(06):9-11. |
| [16] | 葛圣松,邵谦,孙宏飞,唐祥国.高锡化学镀Ni-Sn-P合金工艺[J].功能材料,2004(z1):3235-3237,3242. |
| [17] | JAWORSKA A;BIELINSKI J.Electroless deposition of anticorrosive Ni-Sn-P alloys[J].Ochrona Przed Korozja,2002(zk):416-419. |
| [18] | 闫洪.化学镀Ni-Sn-P合金的结构和耐蚀性[J].航空制造技术,1998(03):25-27. |
| [19] | 李道华.钢铁表面Cu-Sn-P/Ni-Sn-P合金复合镀层的结构和性能[J].西华师范大学学报(自然科学版),2004(02):180-184. |
| [20] | 韩文政,遇元宏,时小军.化学镀Ni-P工艺对镀层结构和性能的影响[J].材料保护,2002(06):51-52. |
| [21] | J. Georgieva;S. Kawashima;S. Armyanov .Electroless Deposition of Ni-Sn-P and Ni-Sn-Cu-P Coatings[J].Journal of the Electrochemical Society,2005(11):C783-C788. |
| [22] | 闫洪.三元化学镀镍合金层的性能研究[J].新技术新工艺,1995(06):40-41. |
| [23] | 司秀丽;吴丰;褚松竹 .化学镀Ni-Sn-P三元合金的工艺和性能的研究[J].功能材料,1995,26(02):189-192. |
| [24] | Zhang Bangwei;Xie Haowen .Effect of alloying elements on the amorphous formation and corrosion resistance of electroless Ni-P based alloys[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2000(1/2):286-291. |
| [25] | 于金库,冯皓,邢广忠,邵光杰,沈德久,王玉林.大冷变形对化学镀Ni-Sn-P非晶态合金晶化的影响[J].人工晶体学报,1998(02):169-172. |
| [26] | 于金库.非晶态化学镀Ni-Sn-P合金镀层变温晶化的研究[J].电镀与精饰,1995(03):8. |
| [27] | 宋长生,王国荣.热处理对化学镀Ni-Sn-P镀层结构和性能的影响[J].电镀与精饰,2000(01):9-11. |
| [28] | BALARAJU J N;JAHAN S M;JAIN A et al.Structure and phase transformation behavior of electroless Ni-P alloys containing tin and tungsten[J].Journal of Alloys and Compounds,2006,8(09):319-327. |
| [29] | 于金库;邵光杰;兰英斌 等.非晶态Ni-Sn-P合金的腐蚀行为[J].腐蚀与防护,1997,18(04):9-10. |
| [30] | SHIMAUCHI H;OZAWA S;TAMURA K .Preparation of Ni-Sn alloys by an electroless-deposition method[J].Journal of the Electrochemical Society,1994,141(06):1471-1476. |
| [31] | AOKI K;TAKANO O;TAKASU I .The electrical contact properties of electroless nickel alloy deposits[J].Hyomen Gijutsu (Journal of the Surface Finishing Society of Japan),1993,44(12):1089-1093. |
| [32] | AOKI K;TAKANO O .Solderability of electroless nickel alloy films[J].J Met Finish Soc Jpn,1981,32(12):643-648. |
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