用球-盘磨损装置研究了电刷镀Cu/Ni纳米多层膜的摩擦磨损性能,采用SEM观察了其表面和截面形貌,并比较了该复合膜层与纯镍镀层的摩擦系数随时间的变化趋势、磨损量以及磨痕形貌.结果表明,该纳米多层膜具有较好的抗微动磨损性能,且晶粒细小,组织致密,界面清晰,各子层厚度均匀;该镀层与纯镍镀层的摩擦系数在达到稳定值后无明显变化;该多层膜的微动磨损方式为粘着疲劳磨损.
参考文献
[1] | WATERHOUSE R B.Fretting corrosion[M].Oxford Pergam on Press,1972:1-7. |
[2] | 张立德;牟季美.纳米材料和纳米结构[M].北京:科学出版社,2001:3-5. |
[3] | 张立德;牟其美.纳米材料学[M].沈阳:辽宁科学技术出版社 |
[4] | OBERLE R R .Dependence of hardness on modulation amplitude in electrodeposited Cu/Ni compositionally modulated thin films[J].Scripta Metallurgica et Materialia,1995,32(04):583-588. |
[5] | TENCH;WHITE .Enhanced tensile strength for electrodeposited nickelcopper multilayer composites[J].Mattal Trans A,1984,15:2093. |
[6] | GOMEE E LABARTA .Characterisation of cobalt/copper mutlilayers obtained by electrodeposition[J].Surface and Coatings Technology,2002,153:261-266. |
[7] | Panagopoulos C.N.;Papachristos V.D. .Ni-P-W MULTILAYERED ALLOY COATINGS PRODUCED BY PULSE PLATING[J].Scripta materialia,2000(7):677-683. |
[8] | COHEN U;KOCH F B;SARD R .Electro chem[J].Soc,1983,130(10):1987. |
[9] | Wang L.;Yuzhang K.;Troyon M.;Bonhomme P.;Douglade J. Metrot A.;Fricoteaux P. .GROWTH MECHANISM AND STRUCTURE OF ELECTRODEPOSITED CU/NI MULTILAYERS[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1995(1/2):160-167. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%