欢迎登录材料期刊网

材料期刊网

高级检索

回顾了微异型接点带制备方法的研究现状,介绍了目前常用的制备方法:电镀+轧制、爆炸复合+拉拔成型、滚焊复合+拉拔成型等及它们的优缺点.分析了目前存在的问题.

参考文献

[1] Lu Baoguo;Jiang Xuan;Lu Biao .The study on the rolling welding of Ag/Cu[J].Materials and Engineering,1997,163:204-205.
[2] 何毅,范金铎,刘力,孔峰.AuAg8/AgNi10/CuNi20复合工艺的研究[J].有色金属,2002(z1):37-40.
[3] 范金铎,何毅,孙秀霞,李勇军,刘凤龙,江轩.AuAg8/Ag复合带与基体CuNi30带的滚焊复合研究[J].有色金属,2002(z1):41-44.
[4] 于朝清,徐孝德,何青云,黄文权,王丽琼.超薄连续复合带的研制[J].电工材料,2002(03):16-20.
[5] Sun Yanhua;Mao Zhoughan;Ding Chun.Development of AuNi5/CuNi44 composite microtapes which was a non-conventional type[J].Rare Metal Materials and Engineering,1988(02):17.
[6] 裴大荣,郭悦霞.层状爆炸金属复合材料的界面特性与金相观察[J].稀有金属材料与工程,1995(06):48-52.
[7] 夏坚平,薛运龙,段庆文,沈其峰,贾勇.金基三层微异型复合线材的新加工方法[J].稀有金属材料与工程,1999(06):398-400.
[8] 孟亮,张雷,周世平,杨富陶,沈其洁.扩散退火对Au/AgCu/Cu-Ni-Zn结合面成分分布的影响[J].稀有金属材料与工程,2002(05):375-378.
[9] 杨富陶,周世平,王海燕.贵金属微异型复合丝材[J].贵金属,1997(04):12-15.
[10] Masanori Ozaki;Utsunomiya;Keiji Mashimo et al.Electric contact materials,production methods thereof and electric contacts used these[P].US 19,1990-05-09.
[11] Vitina I;Rubene;Lubane M .Strcture and phase stability of the chemically deposited Au layers on electrodeposited Ni and Ni-B layers[J].Surface and Coatings Technology,1999,120-121:430-437.
[12] Volkmar L. von Arnim;Jurgen Fessmann;Ludwig Psotta .Plasma treatment of thin gold surfaces for wire bond applications[J].Surface & Coatings Technology,1999(0):517-523.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%